公开(公告)号：US20230209706A1

公开(公告)日：2023-06-29

申请号：US18073561

申请日：2022-12-02

Applicant: Industrial Technology Research Institute

Inventor： Min-Chieh Chou ,  Meng-Chi Huang ,  Tune-Hune Kao ,  Yue-Zhen Huang

IPC: H05K1/02 ,  H05K1/03 ,  G01R1/073

CPC classification number: H05K1/0284 ,  G01R1/07342 ,  H05K1/0306

Abstract: A three-dimensional circuit board, including a ceramic substrate and multiple circuits, is provided. The ceramic substrate has a first plane, a second plane, a third plane located between the first plane and the second plane, a first side surface connecting the first plane and the second plane, and a second side surface connecting the first plane and the third plane and opposite to the first side surface. A first height of the first side surface is greater than a second height of the second side surface. The circuits are separately embedded on the first plane of the ceramic substrate and extend along the first side surface to be embedded on the second plane.

公开(公告)号：US20230204628A1

公开(公告)日：2023-06-29

申请号：US17561997

申请日：2021-12-27

Applicant: Industrial Technology Research Institute

Inventor： Min-Chieh Chou ,  Meng-Chi Huang ,  Tune-Hune Kao ,  Yue-Zhen Huang

IPC: G01R1/073

CPC classification number: G01R1/07342 ,  G01R1/0735

Abstract: A probe card includes a flexible inorganic material layer, a metal micro structure, and a circuit board. The flexible inorganic material layer has a first surface and a second surface opposite to each other. The metal micro structure is disposed on the first surface. The circuit board is disposed on the second surface, and the circuit board is electrically connected to the metal micro structure. The test signal is adapted to be conducted to the circuit board through the flexible inorganic material layer.

公开(公告)号：US11959941B2

公开(公告)日：2024-04-16

申请号：US17561997

申请日：2021-12-27

Applicant: Industrial Technology Research Institute

Inventor： Min-Chieh Chou ,  Meng-Chi Huang ,  Tune-Hune Kao ,  Yue-Zhen Huang

IPC: G01R1/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28

CPC classification number: G01R1/07342 ,  G01R1/0735

Abstract: A probe card includes a flexible inorganic material layer, a metal micro structure, and a circuit board. The flexible inorganic material layer has a first surface and a second surface opposite to each other. The metal micro structure is disposed on the first surface. The circuit board is disposed on the second surface, and the circuit board is electrically connected to the metal micro structure. The test signal is adapted to be conducted to the circuit board through the flexible inorganic material layer.