公开(公告)号：US09826628B2

公开(公告)日：2017-11-21

申请号：US15649031

申请日：2017-07-13

Applicant: Industrial Technology Research Institute

Inventor： Ming-Huan Yang ,  Wei-Ting Chen ,  Chih-Chia Chang

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/028 ,  H05K1/181 ,  H05K2201/09036

Abstract: A flexible electronic module is provided, including a flexible substrate having a supporting portion, a body portion, and a connection portion, wherein the supporting portion is connected with the body portion via the connection portion; a first trench formed between the supporting portion and the body portion; an electronic component disposed over a portion of the supporting portion; and a conductive line disposed over the supporting portion, the connection portion, and the body portion for connecting the electronic component.

公开(公告)号：US09736930B2

公开(公告)日：2017-08-15

申请号：US14250004

申请日：2014-04-10

Applicant: Industrial Technology Research Institute

Inventor： Ming-Huan Yang ,  Wei-Ting Chen ,  Chih-Chia Chang

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/028 ,  H05K1/181 ,  H05K2201/09036

Abstract: A flexible electronic module is provided, including a flexible substrate having a supporting portion, a body portion, and a connection portion, wherein the supporting portion is connected with the body portion via the connection portion; a first trench formed between the supporting portion and the body portion; an electronic component disposed over a portion of the supporting portion; and a conductive line disposed over the supporting portion, the connection portion, and the body portion for connecting the electronic component.