公开(公告)号：US20160336211A1

公开(公告)日：2016-11-17

申请号：US14860721

申请日：2015-09-22

Applicant: Industrial Technology Research Institute

Inventor： Kuan-Wei Chen ,  Pei-Jer Tzeng ,  Chien-Chou Chen ,  Po-Chih Chang

IPC: H01L21/683 ,  H01L21/50 ,  H01L21/78 ,  H01L23/544 ,  H01L29/06

CPC classification number: H01L21/6835 ,  H01L21/50 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/544 ,  H01L29/0657 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2223/54426 ,  H01L2223/5446

Abstract: A bonding structure including a first substrate, a second substrate, and an adhesive layer is provided. The first substrate has a plurality of first trenches. The adhesive layer is located between the first substrate and the second substrate, and the first trenches are filled with the adhesive layer.

Abstract translation: 提供包括第一基板，第二基板和粘合剂层的接合结构。 第一基板具有多个第一沟槽。 粘合剂层位于第一基板和第二基板之间，并且第一沟槽被填充有粘合剂层。

公开(公告)号：US09721824B2

公开(公告)日：2017-08-01

申请号：US14860721

申请日：2015-09-22

Applicant: Industrial Technology Research Institute

Inventor： Kuan-Wei Chen ,  Pei-Jer Tzeng ,  Chien-Chou Chen ,  Po-Chih Chang

IPC: H01L21/683 ,  H01L29/06 ,  H01L21/78 ,  H01L21/50 ,  H01L23/544

CPC classification number: H01L21/6835 ,  H01L21/50 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/544 ,  H01L29/0657 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2223/54426 ,  H01L2223/5446

Abstract: A bonding structure including a first substrate, a second substrate, and an adhesive layer is provided. The first substrate has a plurality of first trenches. The adhesive layer is located between the first substrate and the second substrate, and the first trenches are filled with the adhesive layer.