公开(公告)号：US11605959B2

公开(公告)日：2023-03-14

申请号：US17159729

申请日：2021-01-27

Applicant: ITM SEMICONDUCTOR CO., LTD.

Inventor： Hyuk Hwi Na ,  Ho Seok Hwang ,  Ja Guen Gu ,  Chi Sun Song ,  Seong Beom Park ,  Sun Ho Kim

IPC: H02J7/04 ,  H02J7/00 ,  H02J7/02 ,  H01L25/00 ,  H01L25/065 ,  H01L23/495

Abstract: Provided is a battery control system-in-package including a package substrate, a wireless charger integrated circuit (IC) module mounted on the package substrate, a wired charger IC module mounted on the package substrate, a battery protection IC module mounted on the package substrate, and a single mold provided on the package substrate to encapsulate the wireless charger IC module, the wired charger IC module, and the battery protection IC module.

公开(公告)号：US09767450B2

公开(公告)日：2017-09-19

申请号：US15008506

申请日：2016-01-28

Applicant: ITM SEMICONDUCTOR CO., LTD.

Inventor： Hyeok Hwi Na ,  Ho Seok Hwang ,  Young Seok Kim ,  Seong Beom Park ,  Sang Hoon Ahn ,  Sun Ho Kim

IPC: G06K7/10 ,  G06Q20/34 ,  H02J7/02 ,  G06Q20/32 ,  G07F7/08 ,  G07F7/10 ,  H02J50/80 ,  H04B5/00 ,  H02J50/12 ,  H01Q7/00

CPC classification number: G06Q20/352 ,  G06K7/10297 ,  G06K7/10326 ,  G06Q20/3278 ,  G07F7/0806 ,  G07F7/1008 ,  H01Q7/00 ,  H02J7/025 ,  H02J50/12 ,  H02J50/80 ,  H04B5/0031

Abstract: Provided is an antenna module package including a substrate, a wireless card payment antenna structure mounted on the substrate and including a first antenna chip and wireless card payment matching elements electrically connected to the first antenna chip, a near field communication (NFC) antenna structure mounted on the substrate, sharing the first antenna chip, and including an extended NFC antenna loop and NFC matching elements electrically connected to the first antenna chip, and a wireless charging antenna structure mounted on the substrate and including a second antenna chip, and an extended wireless charging antenna loop and wireless charging matching elements electrically connected to the second antenna chip.

公开(公告)号：US09680973B2

公开(公告)日：2017-06-13

申请号：US14972324

申请日：2015-12-17

Applicant: ITM SEMICONDUCTOR CO., LTD.

Inventor： Hyeok Hwi Na ,  Ho Seok Hwang ,  Young Seok Kim ,  Seong Beom Park ,  Sang Hoon Ahn ,  Sun Ho Kim

IPC: H04M1/02 ,  H01Q1/38 ,  H01Q7/00

CPC classification number: H04M1/026 ,  H01L2224/48145 ,  H01L2224/4903 ,  H01L2924/19105 ,  H01Q1/38 ,  H01Q7/00 ,  H04M2250/04 ,  H01L2924/00012

Abstract: Disclosed is an electronic device capable of near field communication (NFC) and of achieving high integration, size reduction, and good sensitivity. The electronic device includes an antenna chip provided inside a battery protection circuit package of a battery pack and having embedded an NFC antenna therein, and an extended antenna loop electrically connected to the antenna chip and provided outside the battery protection circuit package.