公开(公告)号：US20240167125A1

公开(公告)日：2024-05-23

申请号：US18284172

申请日：2022-03-18

申请人： ISHIFUKU METAL INDUSTRY CO., LTD. ,  YOKOWO CO., LTD.

发明人： Yasunori EGAWA ,  Atsuo MATSUZAWA ,  Koichi HASEGAWA ,  Yosuke IMAI ,  Kenichi SATO

IPC分类号： C22C30/02 ,  C22C5/04 ,  C22C9/00 ,  G01R1/067

CPC分类号： C22C30/02 ,  C22C5/04 ,  C22C9/00 ,  G01R1/06755

摘要： Provided is a probe material (an alloy material for probe pins) that can suppress diffusion of components between solder in a circuit connecting portion of an inspection target and the probe material during probe inspection. The alloy material for probe pins consists of 15 mass % to 60 mass % of Pd, 3 mass % to 79.9 mass % of Cu, and 0.1 mass % to 75 mass % of Ni and/or Pt.