公开(公告)号：US20040256738A1

公开(公告)日：2004-12-23

申请号：US10875473

申请日：2004-06-23

Applicant: International Rectifier Corporation

Inventor： Mark Pavier ,  Tim Sammon

IPC: H01L023/48

CPC classification number: H01L23/5383 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/13091 ,  H01L2924/19105 ,  H05K1/0373 ,  H05K1/095 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/4644 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/083 ,  H05K2201/09672 ,  Y10S257/924 ,  H01L2224/0401

Abstract: An integrated circuit which includes a circuit board having passive elements embedded in its body.

Abstract translation: 一种集成电路，其包括具有嵌入其主体中的无源元件的电路板。

公开(公告)号：US20040147061A1

公开(公告)日：2004-07-29

申请号：US10759549

申请日：2004-01-16

Applicant: International Rectifier Corporation

Inventor： Mark Pavier ,  Tim Sammon ,  Rachel Anderson

IPC: H01L021/48

CPC classification number: H01L23/49562 ,  H01L23/49551 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package includes a lead frame having a displaced integral strap which is cupped out of a lead frame plane to provide a nest that receives a semiconductor chip electrically connected to an inner surface of the cupped strap. The semiconductor package further has a housing molded over and encapsulating the semiconductor chip with the frame such that a surface of the semiconductor chip facing away from the cupped strip is flush with or protrudes beyond a bottom of the housing.

Abstract translation: 半导体封装包括具有位移的整体带的引线框架，其从引线框架平面中拔出，以提供接收电连接到铜带的内表面的半导体芯片的嵌套。 该半导体封装还具有模制在半导体芯片上并将其封装在框架上的壳体，使得半导体芯片的背离杯状条的表面与外壳的底部齐平或突出超出外壳的底部。

公开(公告)号：US20020096749A1

公开(公告)日：2002-07-25

申请号：US10045809

申请日：2002-01-11

Applicant: INTERNATIONAL RECTIFIER CORPORATION

Inventor： Mark Pavier ,  Tim Sammon ,  Rachel Anderson

IPC: H01L023/495 ,  H01L023/28

CPC classification number: H01L23/49562 ,  H01L23/49551 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package includes a lead frame having a displaced integral strap which is cupped out of a lead frame plane to provide a nest that receives a semiconductor chip electrically connected to an inner surface of the cupped strap. The semiconductor package further has a housing molded over and encapsulating the semiconductor chip with the frame such that a surface of the semiconductor chip facing away from the cupped strip is flush with or protrudes beyond a bottom of the housing.

Abstract translation: 半导体封装包括具有位移的整体带的引线框架，其从引线框架平面中拔出，以提供接收电连接到铜带的内表面的半导体芯片的嵌套。 该半导体封装还具有模制在半导体芯片上并将其封装在框架上的壳体，使得半导体芯片的背离杯状条的表面与外壳的底部齐平或突出超出外壳的底部。