公开(公告)号：US20040150096A1

公开(公告)日：2004-08-05

申请号：US10645047

申请日：2003-08-21

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Sampath Purushothaman ,  Anna W. Topol

IPC: H01L023/14

CPC classification number: H01L21/0217 ,  H01L21/02126 ,  H01L21/02266 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/3164 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2224/45147 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/00 ,  H01L2224/48

Abstract: A structure for a semiconductor component is provided having a bi-layer capping coating integrated and built on supporting layer to be transferred. The bi-layer capping protects the layer to be transferred from possible degradation resulting from the attachment and removal processes of the carrier assembly used for layer transfer. A wafer-level layer transfer process using this structure is enabled to create three-dimensional integrated circuits.

Abstract translation: 提供一种用于半导体部件的结构，其具有集成并构建在待传送的支撑层上的双层封盖涂层。 双层封盖保护层免受由用于层转移的载体组件的附接和移除过程所导致的可能的劣化的转移。 使用该结构的晶片级层传送处理能够创建三维集成电路。