公开(公告)号：US20230284543A1

公开(公告)日：2023-09-07

申请号：US17653309

申请日：2022-03-03

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： KANGGUO CHENG ,  JUNTAO LI ,  ZUOGUANG LIU ,  ARTHUR GASASIRA

IPC: H01L45/00

CPC classification number: H01L45/126 ,  H01L45/144 ,  H01L45/1641 ,  H01L45/06 ,  H01L45/1608

Abstract: A semiconductor device is provided. The semiconductor device includes a heater formed on a substrate; a hardmask formed on the heater; a phase change material layer formed on a first side of the heater and the hardmask; a first electrode formed on the phase change material layer on the first side; and a second electrode formed on the substrate on a second side of the heater and the hardmask.