公开(公告)号：US09829915B2

公开(公告)日：2017-11-28

申请号：US14496876

申请日：2014-09-25

Applicant: Intel Corporation

Inventor： Kevin E. Wells ,  Richard C. Stamey

IPC: H05K1/11 ,  H05K3/42 ,  G06F1/16 ,  H05K3/36 ,  H05K1/02 ,  H05K7/02 ,  H05K3/34 ,  H05K1/14

CPC classification number: G06F1/16 ,  H01L2924/0002 ,  H05K1/115 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/421 ,  H05K3/4694 ,  H05K2201/041 ,  H05K2201/09972 ,  H05K2201/10159 ,  H05K2201/10719 ,  Y02P70/613 ,  Y10T29/49128 ,  H01L2924/00

Abstract: Described are apparatuses for modular printed circuit boards (PCB) and methods for producing modular PCBs. An apparatus may include a first PCB module with a first pattern of routing structures on one or more layers of the first PCB module. The apparatus may further include a second PCB module with a second pattern of routing structures on one or more layers of the second PCB module. The second pattern of routing structures may be aligned with and electrically coupled to the first pattern of routing structures without connectors. Other embodiments may be described and/or claimed.

公开(公告)号：US09900983B2

公开(公告)日：2018-02-20

申请号：US15045024

申请日：2016-02-16

Applicant: INTEL CORPORATION

Inventor： Kevin E. Wells ,  Richard C. Stamey

IPC: H05K1/11 ,  H05K7/02 ,  H05K1/02 ,  H05K3/36 ,  H05K3/42 ,  G06F1/16 ,  H05K3/34 ,  H05K1/14 ,  G06F1/18 ,  H01L23/498

CPC classification number: H05K1/115 ,  G06F1/16 ,  G06F1/18 ,  G06F1/183 ,  H01L23/49833 ,  H01L2924/0002 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/421 ,  H05K2201/041 ,  H05K2201/10719 ,  Y02P70/613 ,  Y10T29/49128 ,  H01L2924/00

Abstract: Modular printed circuit board (PCB) structures and methods of producing them are described herein. In some embodiments, a PCB structure may include a first PCB module including first structures on one or more layers of the first PCB module. The PCB structure may further include a second PCB module including second structures on one or more layers of the second PCB module. The PCB structure may additionally include a middle layer between the first PCB module and the second PCB module. The middle layer electrically coupling, without connectors, one or more of the first structures aligned with one or more of the second structures.

公开(公告)号：US20150373847A1

公开(公告)日：2015-12-24

申请号：US14496876

申请日：2014-09-25

Applicant: Intel Corporation

Inventor： Kevin E. Wells ,  Richard C. Stamey

IPC: H05K1/11 ,  H05K3/42 ,  G06F1/16 ,  H05K3/36 ,  H05K1/02 ,  H05K7/02

CPC classification number: G06F1/16 ,  H01L2924/0002 ,  H05K1/115 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/421 ,  H05K3/4694 ,  H05K2201/041 ,  H05K2201/09972 ,  H05K2201/10159 ,  H05K2201/10719 ,  Y02P70/613 ,  Y10T29/49128 ,  H01L2924/00

Abstract: Described are apparatuses for modular printed circuit boards (PCB) and methods for producing modular PCBs. An apparatus may include a first PCB module with a first pattern of routing structures on one or more layers of the first PCB module. The apparatus may further include a second PCB module with a second pattern of routing structures on one or more layers of the second PCB module. The second pattern of routing structures may be aligned with and electrically coupled to the first pattern of routing structures without connectors. Other embodiments may be described and/or claimed.

Abstract translation: 描述了用于模块化印刷电路板（PCB）的装置和用于制造模块化PCB的方法。 装置可以包括具有在第一PCB模块的一个或多个层上的路由结构的第一图案的第一PCB模块。 该装置还可以包括具有在第二PCB模块的一个或多个层上的路由结构的第二图案的第二PCB模块。 路由结构的第二模式可以与没有连接器的路由结构的第一模式对准并电耦合。 可以描述和/或要求保护其他实施例。