公开(公告)号：US20240213328A1

公开(公告)日：2024-06-27

申请号：US18089494

申请日：2022-12-27

申请人： INTEL CORPORATION

发明人： Vinith BEJUGAM ,  Yonggang LI ,  Srinivas V. PIETAMBARAM ,  Chandrasekharan NAIR ,  Whitney BRYKS ,  Gene CORYELL

IPC分类号： H01L29/16 ,  H01L21/768 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48

CPC分类号： H01L29/1606 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/16 ,  H01L2924/15311

摘要： Embodiments disclosed herein include a package substrate. In an embodiment, the package substrate comprises a core with a via opening through the core. In an embodiment, the via opening comprises sidewalls. In an embodiment, a composite layer is provided along the sidewalls, and the composite layer comprises carbon. In an embodiment, the package substrate further comprises a via within the via opening, where the via is electrically conductive.