公开(公告)号：US12174596B2

公开(公告)日：2024-12-24

申请号：US17135729

申请日：2020-12-28

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yuan-Chieh Lo ,  Yu-Hsun Wang ,  Pei-Chun Lin ,  Chih-Hsuan Shih ,  Shu Huang

IPC: G05B13/04 ,  B24B51/00 ,  G05B17/00

Abstract: A grinding and polishing simulation method, a grinding and polishing simulation system and a grinding and polishing process transferring method. The grinding and polishing simulation method includes the following steps. A sensing information of a grinding and polishing apparatus when grinding or polishing a workpiece is obtained. A plurality of model parameters is identified according to the sensing information. At least one quality parameter is calculated according to a machining path, a plurality of process parameters and the plurality of model parameters.