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公开(公告)号:US20130126918A1
公开(公告)日:2013-05-23
申请号:US13730787
申请日:2012-12-28
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor: Chia-Fen HSIEH , Chien-Chun LU , Ya-Hui CHIANG , Chen-Peng HSU , Hung-Lieh HU
IPC: H01L33/50
CPC classification number: H01L33/505 , H01L33/508 , H01L33/60 , H01L2924/0002 , H01L2933/0041 , H05B33/10 , H01L2924/00
Abstract: A light emitting device and a fabricating method thereof are described, wherein the light emitting device includes a substrate, a wall, a first LED chip and a light conversion filling. The first LED chip is disposed on a surface of the substrate. The wall is disposed on the surface of the substrate, and surrounds the first LED chip. A first angle between a central axis of the wall and an inner surface of the wall is 0 degree or is acute, a second angle between the central axis of the wall and an outer surface of the wall is 0 degree or is acute, and the outer surface of the wall and the substrate has a space therebetween. The light conversion filling is surrounded by the light conversion wall, and is disposed on the first LED chip.
Abstract translation: 描述了发光器件及其制造方法,其中发光器件包括衬底,壁,第一LED芯片和光转换填充物。 第一LED芯片设置在基板的表面上。 壁布置在基板的表面上,并围绕第一LED芯片。 壁的中心轴线和壁的内表面之间的第一角度为0度或是锐角,壁的中心轴线与壁的外表面之间的第二角度为0度或是尖锐的,并且 壁和基板的外表面之间具有间隔。 光转换填充物被光转换壁包围,并且设置在第一LED芯片上。
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公开(公告)号:US20130168710A1
公开(公告)日:2013-07-04
申请号:US13710880
申请日:2012-12-11
Applicant: Industrial Technology Research Institute
Inventor: Chun-Hsing LEE , Hung-Lieh HU , Ya-Hui CHIANG , Chao-Wei LI , Chen-Kun CHEN
CPC classification number: H01L27/15 , G02B6/0006 , G02B6/4206 , G02B6/4228 , G02B6/4298 , H01L33/46
Abstract: A semiconductor light source device is provided. The semiconductor light source device includes a light guide, at least one semiconductor light source set and at least one light transformation coupler. The light transformation coupler is disposed between the semiconductor light source set and the light guide for guiding the light emitted from the semiconductor light source set to the light guide. The light transformation coupler has an inclined surface and a curved surface. The inclined surface is a multi-level inclined surface with several slopes.
Abstract translation: 提供半导体光源装置。 半导体光源装置包括光导,至少一个半导体光源组和至少一个光变换耦合器。 光转换耦合器设置在半导体光源组和光导之间,用于将从半导体光源组发射的光引导到光导。 光变换耦合器具有倾斜表面和曲面。 倾斜面是具有多个斜坡的多层倾斜面。
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