Abstract:
A transferable film includes a carrier layer and an intermediate film portion. The carrier layer is configured to receive one or more additional layers and to be releasable from the one or more additional layers temporally proximate to an application of the transferable film to an object. The intermediate film portion includes a readable conductive image portion and is configured for application thereto of an adhesive layer. The intermediate film portion is configured to be interposed between the carrier layer and the adhesive layer, and the adhesive layer configured to adhere to the object for the application of the transferable film to the object.
Abstract:
A front panel overlay having a plurality of layers and one or more logic circuits incorporated therein is disclosed. One of the plurality of layers may have a first electrical contact and another one of the plurality of layers may have a second electrical contact. The one or more logic circuits may be incorporated at least indirectly within the plurality of layers and may be activated when the first electrical contact completes an electrical circuit with the second electrical contact.
Abstract:
A filmic circuit includes a circuit portion and a carrier layer. The circuit portion includes a logic circuit that includes, for example, plural logic gates configurable to receive an input and provide a corresponding logical output. The carrier layer is configured as a film. The circuit portion is affixed directly to the carrier layer or to an upper coat disposed adjacent to the carrier layer, and the carrier layer is configured to be releasable from the circuit portion after the filmic circuit assembly is affixed to a target. The circuit portion is configured to receive an adhesive layer configured to affix the filmic circuit assembly to the target.
Abstract:
A transferable film includes a carrier layer and an intermediate film portion. The carrier layer is configured to receive one or more additional layers and to be releasable from the one or more additional layers temporally proximate to an application of the transferable film to an object. The intermediate film portion includes a readable conductive image portion and is configured for application thereto of an adhesive layer. The intermediate film portion is configured to be interposed between the carrier layer and the adhesive layer, and the adhesive layer configured to adhere to the object for the application of the transferable film to the object.
Abstract:
A method and system for card printing and protection provides for single step construction of a card having an image and a protective overlay. A blank card is fed into a hot stamp module, through which is also fed a supply of overlay or patch film. A thermal transfer printer prints an image onto the overlay or patch before it enters the hot stamp module. The blank card is registered with the printed overlay or patch and then hot stamped together to create the finished card construction. A security printing/application module can also selectively apply a security feature or element to the overlay or patch before it enters the hot stamp module.
Abstract:
A front panel overlay having a plurality of layers and one or more logic circuits incorporated therein is disclosed. One of the plurality of layers may have a first electrical contact and another one of the plurality of layers may have a second electrical contact. The one or more logic circuits may be incorporated at least indirectly within the plurality of layers and may be activated when the first electrical contact completes an electrical circuit with the second electrical contact.
Abstract:
A method providing for the replacement of the traditional release layer of transfer foils uses a plasma treatment to chemically modify the foil side surface of a PET substrate of the transfer foils. The chemically modified surface of the PET substrate provides the necessary low surface energy and release characteristics to allow for the controlled release of the foil from the PET carrier film. Accordingly, plasma treated transfer foils can be made without a release layer.
Abstract:
A method providing for the replacement of the traditional back coat of thermal transfer ribbons or dye sublimation ribbons uses a plasma treatment to chemically modify the print head side surface of a PET substrate of the ribbons. The chemically modified surface of the PET substrate provides the necessary heat resistance and coefficient of friction to allow the thermal print head to function properly without burn-through of the PET carrier film and without sticking to the thermal print head. Accordingly, plasma treated thermal transfer ribbons or dye sublimation ribbons can be made without a back coat.
Abstract:
A transferable film includes a carrier layer and an intermediate portion. The carrier layer is configured to receive one or more additional layers and to be releasable from the one or more additional layers temporally proximate to an application of the transferable film to an object. The intermediate portion includes the one or more additional layers and a circuit. The one or more additional layers include a graphics layer. The intermediate portion is configured for application thereto of an adhesive layer, whereby the intermediate portion is configured to be interposed between the carrier layer and the adhesive layer. The adhesive layer is configured to adhere to the object for the application of the transferable film to the object.