TRANSFERABLE FILM INCLUDING LOGIC CIRCUIT, AND METHODS FOR PROVIDING TRANSFERABLE FILM
    1.
    发明申请
    TRANSFERABLE FILM INCLUDING LOGIC CIRCUIT, AND METHODS FOR PROVIDING TRANSFERABLE FILM 审中-公开
    包括逻辑电路在内的可转移电影及提供可转印电影的方法

    公开(公告)号:US20140263656A1

    公开(公告)日:2014-09-18

    申请号:US13838593

    申请日:2013-03-15

    Abstract: A transferable film includes a carrier layer and an intermediate portion. The carrier layer is configured to receive one or more additional layers and to be releasable from the one or more additional layers temporally proximate to an application of the transferable film to an object. The intermediate portion includes the one or more additional layers and a circuit. The one or more additional layers include a graphics layer. The intermediate portion is configured for application thereto of an adhesive layer, whereby the intermediate portion is configured to be interposed between the carrier layer and the adhesive layer. The adhesive layer is configured to adhere to the object for the application of the transferable film to the object.

    Abstract translation: 可转印膜包括载体层和中间部分。 载体层被配置为接收一个或多个附加层并且可从时间上接近可转移膜施加到物体的一个或多个附加层释放。 中间部分包括一个或多个附加层和电路。 一个或多个附加层包括图形层。 中间部分构造成用于施加粘合剂层,由此中间部分被配置成介于载体层和粘合剂层之间。 粘合剂层被配置为粘附到物体上以将可转移膜施加到物体上。

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