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公开(公告)号:US09655249B2
公开(公告)日:2017-05-16
申请号:US14644289
申请日:2015-03-11
发明人: Toyotaka Shimabe , Masahiro Kaneko , Toshiki Furutani , Takeshi Tashima , Yasuyuki Shimada , Naoki Shimizu
IPC分类号: H05K1/18 , H01G4/008 , H01G4/228 , H01G2/06 , H01L23/50 , H01G4/30 , H01G4/12 , H05K3/46 , H01L23/498
CPC分类号: H05K1/185 , H01G2/06 , H01G4/008 , H01G4/1227 , H01G4/30 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L2924/0002 , H05K3/4602 , H05K2201/068 , H05K2201/10015 , Y10T29/43 , H01L2924/00
摘要: A substrate with a built-in capacitor includes an insulating base material layer, a build-up layer formed on the insulating base material layer and including a conductor layer and an insulating layer, and a multilayer ceramic capacitor positioned in an opening of the base material layer and including internal electrodes, ceramic dielectric layers and a pair of external electrodes. The ceramic capacitor has a cuboid shape having long sides and short sides, the pair of external electrodes is formed on opposing long-side sides such that the external electrodes are separated by a distance in range of 30 μm to 200 μm and that each external electrode includes a conductive paste layer connected to a respective group of the internal electrodes and a copper plated layer covering the conductive paste layer, and the conductive paste layer includes Ni paste or Cu paste including glass component in range of 5% to 40%.
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公开(公告)号:US11017950B2
公开(公告)日:2021-05-25
申请号:US15272680
申请日:2016-09-22
发明人: Kota Zenzai , Hisayoshi Omori , Takashi Kanayama , Kiyoyasu Sakurada , Naoki Shimizu , Seiji Katsuta , Shinji Otani
IPC分类号: H01G7/00 , H01G4/30 , H01G4/12 , H01G4/005 , H01F27/29 , H01F17/00 , H01G4/008 , H01G4/012 , H01G4/248
摘要: A ceramic electronic component includes a ceramic body, an inner electrode, an outer electrode, and a connecting portion. The inner electrode is disposed inside the ceramic body. The end portion of the inner electrode extends to a surface of the ceramic body. The outer electrode is disposed on the surface of the ceramic body so as to cover the end portion of the inner electrode. The outer electrode includes a resin and a metal. The connecting portion is disposed so as to extend from an inside of the outer electrode to an inside of the ceramic body. In a portion of the surface of the ceramic body on which the outer electrode is disposed, the length of the connecting portion that extends in a direction in which the inner electrode is extends about 2.4 μm or more.
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公开(公告)号:US09779876B2
公开(公告)日:2017-10-03
申请号:US14922550
申请日:2015-10-26
发明人: Kota Zenzai , Hisayoshi Omori , Takashi Kanayama , Kiyoyasu Sakurada , Naoki Shimizu , Seiji Katsuta , Shinji Otani
IPC分类号: B32B37/00 , B29C65/00 , C03B29/00 , H01G4/30 , H01G4/252 , H05K3/12 , H01G4/12 , H01G13/00 , H01G4/005 , H01G4/012 , H01G4/248 , H05K3/46
CPC分类号: H01G4/30 , H01G4/005 , H01G4/012 , H01G4/12 , H01G4/248 , H01G4/252 , H01G13/006 , H05K3/1283 , H05K3/4664
摘要: A ceramic body is prepared that includes an inner electrode disposed inside the ceramic body and in which an end portion of the inner electrode is led to a surface of the ceramic body. An electrode layer is formed on the surface of the ceramic body so as to cover the end portion of the inner electrode, the electrode layer containing a resin, a first metal filler that contains a first metal component, and a second metal filler that contains a second metal component having a higher melting point than the first metal component. A heating step of heating the electrode layer is performed to form an electrode including a metal layer that is located on the surface of the ceramic body and that contains the first and second metal components and a metal contained in the inner electrode.
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