公开(公告)号：US11792925B2

公开(公告)日：2023-10-17

申请号：US17555575

申请日：2021-12-20

申请人： IBIDEN CO., LTD.

发明人： Kyohei Yoshikawa

IPC分类号： H05K1/11 ,  H05K1/02 ,  H05K1/03

CPC分类号： H05K1/0313 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/0242 ,  H05K1/0296

摘要： A printed wiring board includes a first resin insulating layer, a second resin insulating layer formed on a surface of the first layer, and a conductor layer formed on the surface of the first layer such that the second layer is covering the conductor layer and that the conductor layer includes first, second, third, fourth, fifth, and sixth circuits such that the third and fourth circuits are sandwiching the first circuit and that the fifth and sixth circuits are sandwiching the second circuit. Widths between the first and third circuits and between the first and fourth circuits are 5 μm to 14 μm, and when a width between the second and fifth circuits and a width between the second and sixth circuits is 20 μm or more, the upper surface of the first circuit, and the upper surface and side walls of the second circuit are formed to have unevenness.

公开(公告)号：US11627658B2

公开(公告)日：2023-04-11

申请号：US17578781

申请日：2022-01-19

申请人： IBIDEN CO., LTD.

发明人： Kyohei Yoshikawa

IPC分类号： H05K1/02

摘要： A printed wiring board includes a first insulating layer, a conductor layer on the first insulating layer, and a second insulating layer formed on the first insulating layer and covering the conductor layer. The conductor layer includes first, second and third circuits, the first circuit has first width of 15 μm or less, the first and second circuits have second space between the first and second circuits such that the second space has second width of 14 μm or less, the first and third circuits have third space between the first and third circuits such that the third space has third width of 20 μm or more, and the first circuit has first lower and upper surfaces, and second and third side walls such that second angle between the second wall and the first lower surface is larger than third angle between the third wall and the first lower surface.

公开(公告)号：US11606861B2

公开(公告)日：2023-03-14

申请号：US17578671

申请日：2022-01-19

申请人： IBIDEN CO., LTD.

发明人： Kyohei Yoshikawa

IPC分类号： H05K1/02 ,  H05K1/11

摘要： A printed wiring board includes a first resin insulating layer, a conductor layer on the first resin insulating layer, and a second resin insulating layer formed on the first resin insulating layer such that the second resin insulating layer is covering the conductor layer. The conductor layer includes a first circuit having a width of 15 μm or less and a rectangular cross-sectional shape, a second circuit having a trapezoidal cross-sectional shape, a third circuit, a fourth circuit, a fifth circuit, and a sixth circuit, a space between the first and third circuits has a width of 14 μm or less, a space between the first and fourth circuits has a width of 14 μm or less, a space between the second and fifth circuits has a width of 20 μm or more, and a space between the second and sixth circuits has a width of 20 μm or more.