公开(公告)号：US10161590B2

公开(公告)日：2018-12-25

申请号：US15676760

申请日：2017-08-14

申请人： Hyundai Motor Company ,  Kia Motors Corporation

发明人： Chan Hee Kang ,  Kwang Jin Park ,  Kyung Ill Won

IPC分类号： F21S45/10 ,  H01L33/48 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  F21Y115/10

摘要： An external light emitting diode package for a vehicle, may include an LED chip; a lead frame which includes a substrate which includes conductive metal and to which one or more LED chips are bonded, and a lead pad which is distanced from the substrate and electrically connected to the LED chip; a mold which is formed on the lead frame and includes a dam that forms a cavity in a region of the substrate where the LED chip is bonded; and a lens which is bonded to the mold, such that the cavity is designed in the mold in an optimum state and the mold and the lens are tightly attached to each other, improving adhesive strength, and the substrate, which is coupled to a mold, includes conductive metal, improving thermal conductivity and surface roughness of the substrate.