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公开(公告)号：US12095387B2
公开(公告)日：2024-09-17
申请号：US17896517
申请日：2022-08-26
Applicant: Huawei Technologies Co., Ltd.
Inventor： Guolei Yu , Shuchao Song , Junliang Qin , Zhiqiang Xiang
CPC classification number: H02M7/4837 , H02M1/0095 , H02M3/158 , H02M7/487
Abstract: A multi-level direct current converter includes a direct current conversion unit, a switching unit, a voltage management unit, and a controller. The direct current conversion unit includes a flying capacitor, a first power transistor, and a second power transistor. A first end of the first power transistor is connected to a voltage input end of the multi-level direct current converter, a second end of the first power transistor is connected to a first end of the second power transistor by using the flying capacitor, and a second end of the second power transistor is connected to a reference ground.
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公开(公告)号：US12224146B2
公开(公告)日：2025-02-11
申请号：US17955796
申请日：2022-09-29
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Chao Shen , Zhiqiang Xiang , Xiaojing Liao
IPC: H01H85/046 , H01H85/06 , H05K1/18
Abstract: This application provides an embedded substrate, a circuit board assembly, and an electronic device. The embedded substrate in this application includes an insulation layer, and an electronic element and a conductive connector that are embedded inside the insulation layer. The conductive connector is electrically connected to the electronic element. The conductive connector includes at least one fuse unit, each of the at least one fuse unit includes a fusible structure and two electrical connection ends, the fusible structure is connected between the two electrical connection ends in a direction of an electrical path of the conductive connector, and the fusible structure is configured to be blown when a passing current exceeds a preset current threshold, to disconnect an electrical connection between the electronic element and an external connection end. In this application, maintenance and replacement costs are low during current burning prevention, and a volume is compact.
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3.发明授权公开(公告)号：US11887918B2
公开(公告)日：2024-01-30
申请号：US17709100
申请日：2022-03-30
Applicant: Huawei Technologies Co., Ltd.
Inventor： Xuanwei Fang , Zhiqiang Xiang
CPC classification number: H01L23/49811 , H01L25/16 , H05K1/18 , H05K3/0097 , H05K3/284 , H05K3/3405 , H05K2201/1034 , H05K2203/0228 , H05K2203/1316
Abstract: Disclosed is a packaging solution, such as a lead frame for circuit board packaging, a packaged integrated circuit board, a power chip, and a circuit board packaging method. The lead frame includes a plurality of frame units disposed in parallel in a first direction. The frame unit includes a hollow bezel, and a plurality of pins and connecting ribs that are disposed in the bezel. Each pin includes a first pin part and a second pin part that extend in a second direction and are integrally formed. The first pin part is disposed in the bezel, the first pin part is configured to electrically connect to a circuit board, and the second pin part is connected and fastened to the bezel. The second direction is perpendicular to the first direction. The connecting ribs are connected among the plurality of pins and the bezel.
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Patent Agency Ranking
4.发明授权公开(公告)号：US11063517B2
公开(公告)日：2021-07-13
申请号：US16750999
申请日：2020-01-23
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yujian Lin , Haitao Chen , Yue Chen , Zhiqiang Xiang
Abstract: A power supply circuit is disclosed. The circuit includes n capacitors, m power branches, and a control chip, where the m power branches include at least one first-type power branch and at least one second-type power branch, the first-type power branch includes a pre-boost topology structure and an open-loop topology structure connected in series to the pre-boost topology structure, the pre-boost topology structure is connected to the control chip, the pre-boost topology structure includes a straight-through state and a closed-loop state, and the control chip is configured to control, based on an output voltage of the power source, the pre-boost topology structure to switch between the straight-through state and the closed-loop state, so that the pre-boost topology structure pre-adjusts the output voltage of the power source and outputs a voltage range that meets a requirement of the open-loop topology structure.
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公开(公告)号：US09431916B2
公开(公告)日：2016-08-30
申请号：US14706604
申请日：2015-05-07
Applicant: Huawei Technologies Co., Ltd.
Inventor： Zhiqiang Xiang
CPC classification number: H02M3/33576 , H02M1/088 , H02M3/158 , H02M3/337 , H02M2001/0048 , H02M2001/007 , H02M2001/008
Abstract: A power supply bus circuit, includes a voltage regulator circuit, and an impedance isolation circuit, and further including one or more voltage adjustment circuits, where the voltage regulator circuit receives a direct current signal, adjusts a voltage of the direct current signal to a first preset voltage, and outputs a direct current signal of the first preset voltage to the impedance isolation circuit; the impedance isolation circuit receives the direct current signal of the first preset voltage, adjusts the direct current signal of the first preset voltage to an alternating current signal, and outputs, by using a transformer, the alternating current signal in an isolated way and converts the alternating current signal that is output in an isolated way to an isolated direct current signal, and outputs the isolated direct current signal to the voltage adjustment circuit.
Abstract translation: 一种电源总线电路，包括电压调节器电路和阻抗隔离电路，并且还包括一个或多个电压调节电路，其中电压调节器电路接收直流信号，将直流信号的电压调节到第一 预置电压，并将第一预设电压的直流信号输出到阻抗隔离电路; 阻抗隔离电路接收第一预设电压的直流信号，将第一预设电压的直流信号调整为交流信号，并以隔离方式使用变压器输出交流信号，并将 以隔离的方式输出到隔离直流信号的交流信号，并将隔离的直流信号输出到电压调节电路。
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公开(公告)号：US20150326104A1
公开(公告)日：2015-11-12
申请号：US14706604
申请日：2015-05-07
Applicant: Huawei Technologies Co., Ltd.
Inventor： Zhiqiang Xiang
CPC classification number: H02M3/33576 , H02M1/088 , H02M3/158 , H02M3/337 , H02M2001/0048 , H02M2001/007 , H02M2001/008
Abstract: A power supply bus circuit, includes a voltage regulator circuit, and an impedance isolation circuit, and further including one or more voltage adjustment circuits, where the voltage regulator circuit receives a direct current signal, adjusts a voltage of the direct current signal to a first preset voltage, and outputs a direct current signal of the first preset voltage to the impedance isolation circuit; the impedance isolation circuit receives the direct current signal of the first preset voltage, adjusts the direct current signal of the first preset voltage to an alternating current signal, and outputs, by using a transformer, the alternating current signal in an isolated way and converts the alternating current signal that is output in an isolated way to an isolated direct current signal, and outputs the isolated direct current signal to the voltage adjustment circuit.
Abstract translation: 一种电源总线电路，包括电压调节器电路和阻抗隔离电路，并且还包括一个或多个电压调节电路，其中电压调节器电路接收直流信号，将直流信号的电压调节到第一 预置电压，并将第一预设电压的直流信号输出到阻抗隔离电路; 阻抗隔离电路接收第一预设电压的直流信号，将第一预设电压的直流信号调整为交流信号，并以隔离方式使用变压器输出交流信号，并将 以隔离的方式输出到隔离直流信号的交流信号，并将隔离的直流信号输出到电压调节电路。
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公开(公告)号：US12205876B2
公开(公告)日：2025-01-21
申请号：US17570889
申请日：2022-01-07
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Zhiqiang Xiang
IPC: H01L23/15 , H01L21/48 , H01L23/14 , H01L23/498
Abstract: This application provides an embedded packaging structure, a preparation method thereof, and a terminal device. The embedded packaging structure includes a substrate frame, and a first through hole and a second through hole that run through the substrate frame in a thickness direction of the substrate frame. A metal connection electrode is disposed in the first through hole, an electronic component is embedded in the second through hole, and a pin of the electronic component is exposed at a hole opening of the second through hole. The substrate frame is made of silicon or a ceramic. Compared with a prior art substrate frame formed by using a resin material, the substrate frame in this application has better heat dissipation performance, moisture resistance, and strength in addition to providing insulation.
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公开(公告)号：US20230061103A1
公开(公告)日：2023-03-02
申请号：US17896517
申请日：2022-08-26
Applicant: Huawei Technologies Co., Ltd.
Inventor： Guolei Yu , Shuchao Song , Junliang Qin , Zhiqiang Xiang
Abstract: A multi-level direct current converter includes a direct current conversion unit, a switching unit, a voltage management unit, and a controller. The direct current conversion unit includes a flying capacitor, a first power transistor, and a second power transistor. A first end of the first power transistor is connected to a voltage input end of the multi-level direct current converter, a second end of the first power transistor is connected to a first end of the second power transistor by using the flying capacitor, and a second end of the second power transistor is connected to a reference ground.
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