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公开(公告)号：US20140097533A1
公开(公告)日：2014-04-10
申请号：US14107808
申请日：2013-12-16
发明人： Weifeng Liu , Yuming Ye , Zhao Xiang , Zhi Xu
IPC分类号： H01L25/065 , H01L23/34
CPC分类号： H01L23/34 , H01L23/36 , H01L23/3672 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/73253 , H01L2225/06517 , H01L2225/0652 , H01L2225/06572 , H01L2225/06589 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/10253 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H01L2924/00
摘要： A package on package (PoP) package structure is disclosed, the structure includes at least two layers of carrier boards that are packaged and stacked in sequence, wherein chips are arranged on the bottom side of the carrier boards, a heat sink is arranged on the bottom side of a carrier board other than a layer-1 carrier board, a pad welded to a system board is arranged on the bottom side of the layer-1 carrier board, and a chip on a carrier board other than a top-layer carrier board is surface-mounted onto the heat sink adjacent to the chip. The heat sink increases the heat dissipation area of the chip, enhances the heat dissipation capabilities of the PoP stacked packages massively, breaks the bottleneck of the high-density integration and miniaturization of the PoP stacked packages, and enhances the packaging density of the PoP stacked packages.
摘要翻译： 公开了一种封装（PoP）封装结构，该结构包括依次包装和堆叠的至少两层承载板，其中芯片布置在承载板的底侧，散热器布置在 在层1载体板之外的载体板的底侧，焊接到系统板的焊盘布置在层1载体板的底侧，并且在除了顶层载体之外的载体板上的芯片 板被表面安装在与芯片相邻的散热器上。 散热片增加了芯片的散热面积，大大提高了PoP堆叠封装的散热能力，打破了PoP堆叠封装高密度集成和小型化的瓶颈，提高了PoP堆叠封装的封装密度 包装
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公开(公告)号：US09318407B2
公开(公告)日：2016-04-19
申请号：US14107808
申请日：2013-12-16
发明人： Weifeng Liu , Yuming Ye , Zhao Xiang , Zhi Xu
IPC分类号： H01L23/10 , H01L23/34 , H01L23/36 , H01L23/367 , H01L25/10 , H01L25/065
CPC分类号： H01L23/34 , H01L23/36 , H01L23/3672 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/73253 , H01L2225/06517 , H01L2225/0652 , H01L2225/06572 , H01L2225/06589 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/10253 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H01L2924/00
摘要： A package on package (PoP) package structure is disclosed, the structure includes at least two layers of carrier boards that are packaged and stacked in sequence, wherein chips are arranged on the bottom side of the carrier boards, a heat sink is arranged on the bottom side of a carrier board other than a layer-1 carrier board, a pad welded to a system board is arranged on the bottom side of the layer-1 carrier board, and a chip on a carrier board other than a top-layer carrier board is surface-mounted onto the heat sink adjacent to the chip. The heat sink increases the heat dissipation area of the chip, enhances the heat dissipation capabilities of the PoP stacked packages massively, breaks the bottleneck of the high-density integration and miniaturization of the PoP stacked packages, and enhances the packaging density of the PoP stacked packages.
摘要翻译： 公开了一种封装（PoP）封装结构，该结构包括依次包装和堆叠的至少两层承载板，其中芯片布置在承载板的底侧，散热器布置在 在层1载体板之外的载体板的底侧，焊接到系统板的焊盘布置在层1载体板的底侧，并且在除了顶层载体之外的载体板上的芯片 板被表面安装在与芯片相邻的散热器上。 散热片增加了芯片的散热面积，大大提高了PoP堆叠封装的散热能力，打破了PoP堆叠封装高密度集成和小型化的瓶颈，提高了PoP堆叠封装的封装密度 包装
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