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公开(公告)号：US09739960B2
公开(公告)日：2017-08-22
申请号：US14980458
申请日：2015-12-28
Applicant: Huawei Technologies Co., Ltd.
Inventor： Shuliang Huang , Zaomeng Liu , Liqian Zhai
CPC classification number: G02B6/4272 , G02B6/4269 , G02B6/4271 , H05K7/2039 , H05K7/2049
Abstract: An optical module heat dissipation structure, disposed inside an enclosure, where the optical module heat dissipation structure includes an optical module, an elastic component, a fixed wall, and a heat dissipation wall, where the fixed wall and the heat dissipation wall are both connected to the enclosure, the optical module is disposed between the fixed wall and the heat dissipation wall, the elastic component elastically abuts between the fixed wall and the optical module, and elasticity of the elastic component makes the optical module tightly cling to the heat dissipation wall, to improve the heat dissipation efficiency of the optical module heat dissipation structure. An electronic product is further provided where the electronic product includes the optical module heat dissipation structure.
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公开(公告)号：US09307671B2
公开(公告)日：2016-04-05
申请号：US13964948
申请日：2013-08-12
Applicant: Huawei Technologies Co., Ltd.
Inventor： Shuliang Huang , Zhaoxia Luo , Youhe Ke
CPC classification number: H05K7/20 , H05K7/20727
Abstract: Embodiments of the present invention relate to a board cooling apparatus comprising a shell and a board, where the board and an interior wall of the shell form a closed space, a cooling medium inlet and a cooling medium outlet are disposed on the shell, a separator plate that separates the board into a first part and a second part, a through opening between the first part and the second part, a cooling medium flows into the first part from the cooling medium inlet and then flows into the second part, and flows out from the cooling medium outlet, a flow guiding mechanism that is disposed on the board and configured to divert the cooling medium flowing into the first part from the cooling medium inlet, so as to directly guide part of the cooling medium into the second part.
Abstract translation: 本发明的实施例涉及一种包括壳体和板的板冷却装置，其中板和壳体的内壁形成封闭空间，冷却介质入口和冷却介质出口设置在壳体上，分离器 板将板分成第一部分和第二部分，第一部分和第二部分之间的通孔，冷却介质从冷却介质入口流入第一部分，然后流入第二部分，并流出 从所述冷却介质出口排出的流动引导机构，所述流动引导机构设置在所述板上并且构造成将从所述冷却介质入口流入所述第一部分的冷却介质转向，以将所述冷却介质的一部分直接引导到所述第二部分。
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公开(公告)号：US20160079729A1
公开(公告)日：2016-03-17
申请号：US14948558
申请日：2015-11-23
Applicant: Huawei Technologies Co., Ltd.
Inventor： Shuliang Huang , Mingliang Hao , Zaomeng Liu
CPC classification number: H01S5/02469 , H01L41/081 , H01L41/09 , H01S5/022 , H01S5/02208 , H01S5/02248 , H01S5/02407 , H05K1/0209 , H05K2201/10121
Abstract: A heat dissipation system for an optical module, related to communication fittings technologies, is provided to improve heat dissipation efficiency of the optical module. The heat dissipation system for an optical module includes a circuit card on which at least one optical module is mounted, where the optical module includes a housing and a laser disposed inside the housing. A first heat dissipation apparatus is fixedly disposed on the circuit card. A heat dissipation window is provided in an area that is above the laser and on the housing of the optical module. The first heat dissipation apparatus performs heat dissipation on the heat dissipation window.
Abstract translation: 提供了与通信配件技术相关的用于光学模块的散热系统，以提高光学模块的散热效率。 用于光学模块的散热系统包括其上安装有至少一个光学模块的电路卡，其中光学模块包括壳体和设置在壳体内的激光器。 第一散热装置固定地设置在电路卡上。 在激光器上方和光学模块的壳体上的区域中设置散热窗口。 第一散热装置在散热窗上进行散热。
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Patent Agency Ranking
4.发明申请Electronic Device, and Heat Dissipation System and Heat Dissipation Method of Electronic Device 审中-公开电子设备，散热系统和电子设备的散热方法公开(公告)号：US20140352928A1
公开(公告)日：2014-12-04
申请号：US14462810
申请日：2014-08-19
Applicant: Huawei Technologies Co., Ltd.
Inventor： Shuliang Huang , Zhaoxia Luo , Youhe Ke
IPC: H05K7/20
CPC classification number: H05K7/20236 , H05K7/20772
Abstract: An electronic device and a heat dissipation system and heat dissipation method are provided that can be used in combination with a common heat exchange/refrigerating electronic device, thereby reducing an investment cost. The heat dissipation system of an electronic device includes a cooling pool, a heat exchanger, and at least one circulating pump, where a cooling medium is provided in the cooling pool, and the electronic device and the heat exchanger are immersed in the cooling medium; the circulating pump is configured to drive the cooling medium to circulatively flow between the electronic device and the heat exchanger; and a heat exchange medium is provided in the heat exchanger and used to exchange heat with the cooling medium, and the heat exchange medium flows out of the heat exchanger for cooling and then flows back, so as to discharge heat released by the electronic device.
Abstract translation: 本发明提供一种电子设备和散热系统及散热方法，其可以与普通的热交换/制冷电子设备结合使用，从而降低了投资成本。 电子设备的散热系统包括冷却池，热交换器和至少一个循环泵，其中在冷却池中设置冷却介质，电子设备和热交换器浸入冷却介质中; 循环泵构造成驱动冷却介质循环地在电子设备和热交换器之间流动; 并且在热交换器中设置有热交换介质，用于与冷却介质进行热交换，并且热交换介质流出热交换器进行冷却，然后流回，从而排出由电子设备释放的热量。
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公开(公告)号：US20140071625A1
公开(公告)日：2014-03-13
申请号：US14081654
申请日：2013-11-15
Applicant: Huawei Technologies Co., Ltd.
Inventor： Zhaoxia Luo , Shuliang Huang , Youhe Ke , Liqian Zhai
IPC: H05K7/20
CPC classification number: H05K7/20236 , H05K7/20272
Abstract: Embodiments of the present invention provide an immersion cooling system, including: an electronic device, a non-conductive working medium, and one or more gasbags. The electronic device is immersed in the non-conductive working medium; the non-conductive working medium is configured to dissipate heat for the electronic device, and a volume of the non-conductive working medium expands as a temperature rises; and a surface of the gasbag is elastic, and the gasbag is configured to reduce its volume when the gasbag is compressed by volume expansion of the non-conductive working medium, so as to buffer a pressure rise in the system, where the pressure rise is caused by the volume expansion of the non-conductive working medium. With the immersion cooling system provided in the embodiments of the present invention, installation is more flexible and cooling performance of the system is further improved.
Abstract translation: 本发明的实施例提供了一种浸没冷却系统，包括：电子装置，非导电工作介质和一个或多个气囊。 电子器件浸没在非导电工作介质中; 非导电工作介质被配置为耗散用于电子设备的热量，并且一部分非导电工作介质的体积随温度升高而膨胀; 并且所述气囊的表面是弹性的，并且所述气囊被构造成当所述气囊被所述非导电工作介质的体积膨胀压缩时减小其体积，以缓冲所述系统中的压力升高，其中所述压力升高为 这是由非导电工作介质的体积膨胀引起的。 利用在本发明的实施例中提供的浸入式冷却系统，安装更加灵活，进一步提高了系统的冷却性能。
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公开(公告)号：US09660414B2
公开(公告)日：2017-05-23
申请号：US14948558
申请日：2015-11-23
Applicant: Huawei Technologies Co., Ltd.
Inventor： Shuliang Huang , Mingliang Hao , Zaomeng Liu
CPC classification number: H01S5/02469 , H01L41/081 , H01L41/09 , H01S5/022 , H01S5/02208 , H01S5/02248 , H01S5/02407 , H05K1/0209 , H05K2201/10121
Abstract: A heat dissipation system for an optical module, related to communication fittings technologies, is provided to improve heat dissipation efficiency of the optical module. The heat dissipation system for an optical module includes a circuit card on which at least one optical module is mounted, where the optical module includes a housing and a laser disposed inside the housing. A first heat dissipation apparatus is fixedly disposed on the circuit card. A heat dissipation window is provided in an area that is above the laser and on the housing of the optical module. The first heat dissipation apparatus performs heat dissipation on the heat dissipation window.
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公开(公告)号：US20160109670A1
公开(公告)日：2016-04-21
申请号：US14980458
申请日：2015-12-28
Applicant: Huawei Technologies Co., Ltd.
Inventor： Shuliang Huang , Zaomeng Liu , Liqian Zhai
CPC classification number: G02B6/4272 , G02B6/4269 , G02B6/4271 , H05K7/2039 , H05K7/2049
Abstract: An optical module heat dissipation structure, disposed inside an enclosure, where the optical module heat dissipation structure includes an optical module, an elastic component, a fixed wall, and a heat dissipation wall, where the fixed wall and the heat dissipation wall are both connected to the enclosure, the optical module is disposed between the fixed wall and the heat dissipation wall, the elastic component elastically abuts between the fixed wall and the optical module, and elasticity of the elastic component makes the optical module tightly cling to the heat dissipation wall, to improve the heat dissipation efficiency of the optical module heat dissipation structure. An electronic product is further provided where the electronic product includes the optical module heat dissipation structure.
Abstract translation: 一种光学模块散热结构，设置在外壳内，其中光学模块散热结构包括光学模块，弹性部件，固定壁和散热壁，其中固定壁和散热壁都连接 光学模块设置在固定壁和散热壁之间，弹性部件弹性地抵接在固定壁与光学模块之间，弹性部件的弹性使得光学模块紧贴在散热壁上 ，以提高光模块散热结构的散热效率。 进一步提供电子产品，其中电子产品包括光学模块散热结构。
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公开(公告)号：US20130329362A1
公开(公告)日：2013-12-12
申请号：US13964948
申请日：2013-08-12
Applicant: Huawei Technologies Co., Ltd.
Inventor： Shuliang Huang , Zhaoxia Luo , Youhe Ke
IPC: H05K7/20
CPC classification number: H05K7/20 , H05K7/20727
Abstract: Embodiments of the present invention relate to a board cooling apparatus comprising a shell and a board, where the board and an interior wall of the shell form a closed space, a cooling medium inlet and a cooling medium outlet are disposed on the shell, a separator plate that separates the board into a first part and a second part, a through opening between the first part and the second part, a cooling medium flows into the first part from the cooling medium inlet and then flows into the second part, and flows out from the cooling medium outlet, a flow guiding mechanism that is disposed on the board and configured to divert the cooling medium flowing into the first part from the cooling medium inlet, so as to directly guide part of the cooling medium into the second part.
Abstract translation: 本发明的实施例涉及一种包括壳体和板的板冷却装置，其中板和壳体的内壁形成封闭空间，冷却介质入口和冷却介质出口设置在壳体上，分离器 板将板分成第一部分和第二部分，第一部分和第二部分之间的通孔，冷却介质从冷却介质入口流入第一部分，然后流入第二部分，并流出 从所述冷却介质出口排出的流动引导机构，所述流动引导机构设置在所述板上并且构造成将从所述冷却介质入口流入所述第一部分的冷却介质转向，以将所述冷却介质的一部分直接引导到所述第二部分。
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