公开(公告)号：US20250157945A1

公开(公告)日：2025-05-15

申请号：US19024776

申请日：2025-01-16

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xuan Wang ,  Po Shi ,  Zhengde Yang ,  Yongsheng Li

IPC: H01L23/552 ,  H01L21/56 ,  H01L21/77 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/16 ,  H10B80/00 ,  H10D80/30

Abstract: A chip package structure includes a substrate, a chip, and a shielding layer. The substrate includes a plurality of stacked metal layers. A first conductive column runs through at least two metal layers, and has a first contact surface that is exposed to an outer side of the substrate and that faces a top surface of the substrate. The chip is disposed on the top surface of the substrate. The shielding layer is formed outside the chip, and is connected to the first conductive column through the first contact surface, and the shielding layer is grounded. In the chip package structure, the shielding layer is connected to the first conductive column through contact with the first contact surface, and is grounded to form an electromagnetic shielding cavity.

公开(公告)号：US20230378980A1

公开(公告)日：2023-11-23

申请号：US18362377

申请日：2023-07-31

Applicant: Huawei Technologies Co., Ltd.

Inventor： Weinan Li ,  Weitao Jing ,  Po Shi

IPC: H04B1/00

CPC classification number: H04B1/0028 ,  H04B1/0067

Abstract: Embodiments of this application disclose a communication circuit, including: a shared radio frequency circuit, a baseband processing circuit, and an antenna. The antenna is configured to receive and send a first-mode signal and a second-mode signal. The shared radio frequency circuit is coupled between the baseband processing circuit and the antenna, and the shared radio frequency circuit is configured to process the first-mode signal and the second-mode signal in a time-division manner. The shared radio frequency circuit includes a slave control interface, and the baseband processing circuit includes a master control interface. The master control interface is coupled to the slave control interface by using a control bus, and is used for configuring the shared radio frequency circuit to process the first-mode signal and the second-mode signal in the time-division manner.