公开(公告)号：US20160211737A1

公开(公告)日：2016-07-21

申请号：US15083853

申请日：2016-03-29

Applicant: Huawei Technologies Co., Ltd.

Inventor： Dan Yang ,  Qinghai Wang ,  Yongfa Zhu

IPC: H02M1/12 ,  H02M1/44 ,  H02M3/158

CPC classification number: H02M1/12 ,  H02M1/44

Abstract: An active filter, which may effectively suppress the low-frequency noise, includes a main circuit and a control circuit. The control circuit is configured to detect a first current output by a negative electrode of an input end of a conversion circuit to acquire an alternating current component (harmonic component) in the first current, and generate a control signal according to the harmonic component. The main circuit is configured to generate, under the control of the control signal, a second current having a phase opposite to a phase of the harmonic component, so that a source current formed after the first current and the second current pass through a power source is a direct current.

Abstract translation: 可以有效地抑制低频噪声的有源滤波器包括主电路和控制电路。 控制电路被配置为检测由转换电路的输入端的负电极输出的第一电流，以获得第一电流中的交流分量（谐波分量），并根据谐波分量产生控制信号。 主电路被配置为在控制信号的控制下产生具有与谐波分量的相位相反的相位的第二电流，使得在第一电流和第二电流之后形成的源极电流通过电源 是直流电。

公开(公告)号：US11641072B2

公开(公告)日：2023-05-02

申请号：US17327297

申请日：2021-05-21

Applicant: Huawei Technologies Co., Ltd.

Inventor： Weijian Pan ,  Zhixiang Hu ,  Dan Yang

IPC: H01R12/00 ,  H01R12/70 ,  H01R12/73 ,  H05K3/00 ,  H05K3/04

Abstract: This application relates to the field of power supply packaging technologies, and in particular, to a PCB-pinout based packaged module, including a packaged module and a pin exposed outside the packaged module. The packaged module includes a PCB and a power component. The PCB has a first surface and a second surface that are disposed opposite to each other, and the power component is disposed on the first surface or the second surface of the PCB. The power component performs communication connection with a pin located on one side of the first surface or one side of the second surface of the PCB through surface-layer copper of the PCB. The pin located on one side of the first surface or one side of the second surface of the PCB is a surface-layer copper etching pattern that is located on the PCB and that is exposed outside the packaged module.