公开(公告)号：US20240312895A1

公开(公告)日：2024-09-19

申请号：US18672681

申请日：2024-05-23

申请人： Huawei Digital Power Technologies Co., Ltd.

发明人： Huibin Chen ,  Yutao Wang ,  Haiyan Liu ,  Song Chen ,  Zhonghua Yin ,  Zhen Lv ,  Zhaoyue Wang ,  Qiliang Yang

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L23/373

CPC分类号： H01L23/49838 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/26 ,  H01L24/32 ,  H01L24/33 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181

摘要： A power module is provided that may include a first metal-clad substrate, a chip located on a side of the first metal-clad substrate, and first solder located between the first metal-clad substrate and the chip. A first metal layer is disposed on a surface that is of the first metal-clad substrate and that faces the chip, and the first metal layer includes a groove and a blocking part. A first thickness of the first metal layer is less than a second thickness. The first thickness is a thickness of at least a part of an area in the blocking part, and the second thickness is a thickness of the first metal layer in an area other than the groove and the blocking part. The blocking part is located between the chip and the adjacent groove, and is configured to prevent the first solder from overflowing into the groove.