公开(公告)号：US20120074456A1

公开(公告)日：2012-03-29

申请号：US13304510

申请日：2011-11-25

Applicant: Hongboem JIN

Inventor： Hongboem JIN

IPC: H01L33/62 ,  H01L33/64

CPC classification number: H01L33/642 ,  H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85409 ,  H01L2224/85411 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/8546 ,  H01L2224/85466 ,  H01L2224/85469 ,  H01L2224/85471 ,  H01L2224/85476 ,  H01L2224/85481 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device package is disclosed. The disclosed light emitting device package includes a body comprising a cavity, and a recess formed at a bottom surface of the body, first and second lead frames mounted in the body, and a light source electrically connected with the first and second lead frames, wherein at least one of the first and second lead frames has a heat sink which is extended from a portion of the first or the second lead frames, and is disposed in the recess. The body includes a first coupler formed on at least a portion of the body. The heat sink includes a second coupler, to which the first coupler is coupled.

Abstract translation: 公开了一种发光器件封装。 所公开的发光器件封装包括：主体，其包括空腔，形成在主体的底表面处的凹部，安装在主体中的第一引线框架和第二引线框架以及与第一引线框架和第二引线框架电连接的光源，其中 第一引线框架和第二引线框架中的至少一个具有从第一引线框架或第二引线框架的一部分延伸的散热器，并且设置在凹部中。 主体包括形成在主体的至少一部分上的第一联接器。 散热器包括第二耦合器，第一耦合器耦合到第二耦合器。