公开(公告)号：US20180030327A1

公开(公告)日：2018-02-01

申请号：US15642082

申请日：2017-07-05

申请人： Honeywell International Inc.

发明人： Liqiang Zhang ,  Huifeng Duan ,  Kai Zhang ,  Ya Qun Liu ,  Ling Shen ,  Wei Jun Wang ,  Haigang Kang

IPC分类号： C09K5/14 ,  H05K7/20 ,  C08K3/22

CPC分类号： C09K5/14 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2003/2296 ,  C08K2201/001 ,  C08K2201/014 ,  H05K7/2039

摘要： A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes at least one silicone oil, and at least one thermally conductive filler.

公开(公告)号：US10781349B2

公开(公告)日：2020-09-22

申请号：US16081649

申请日：2016-03-08

申请人： Honeywell International Inc. ,  Liqiang Zhang ,  Wei Jun Wang ,  Ya Qun Liu ,  Hong Min Huang

发明人： Liqiang Zhang ,  Wei Jun Wang ,  Ya Qun Liu ,  Hong Min Huang

IPC分类号： H01L23/373 ,  C09K5/06 ,  H01L23/367 ,  H01L23/00 ,  H01L23/498 ,  H01L23/42

摘要： A thermal interface material includes, in one exemplary embodiment, at least one polymer, at least one phase change material, at least one crosslinker, and at least one thermally conductive filler. The at least one thermally conductive includes a first plurality of particles having a particle diameter of about 1 micron or less. The at least one thermally conductive filler comprises at least 80 wt. % of the total weight of the thermal interface material. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.

公开(公告)号：US10150889B2

公开(公告)日：2018-12-11

申请号：US14916844

申请日：2014-09-08

申请人： HONEYWELL INTERNATIONAL INC.

发明人： Ya Qun Liu ,  Bright Zhang ,  Huifeng Duan ,  Wanchao Jiang ,  Yunzi Jiang ,  Zhe Ding ,  David K. Chen ,  Yanming Shen ,  Wei Jun Wang

IPC分类号： C09D183/08 ,  C08K3/36 ,  C08G77/24 ,  C08K3/38 ,  C08K3/22

摘要： Poly fluorine-containing siloxane coatings having improved hydrophobic and oleophobic properties and solutions for creating such coatings are provided. In some embodiments, the coating includes a polymer having a plurality of Si—O—Si linkages; and at least two fluorine-containing moieties, each attached to at least one of the Si—O—Si linkages. Each fluorine-containing moiety independently includes a linking portion attached to a silicon of one of the Si—O—Si linkages, wherein the linking portion is of a formula selected from the group consisting of: —[CH2]a— where a is an integer from 1 to 10 and —[CH2]bCONH[CH2]c— where b and c are independently an integer from 0 to 10. Each fluorine-containing moiety also independently includes a fluorinated portion attached to the linking portion, wherein the fluorinated portion is selected from a fluorinated-alkyl group having 1-10 carbon atoms and a perfluoro-ether containing organic group.

公开(公告)号：US20170321100A1

公开(公告)日：2017-11-09

申请号：US15531253

申请日：2014-12-05

申请人： Honeywell International Inc.

发明人： Liqiang Zhang ,  Ling Shen ,  Hui Wang ,  Ya Qun Liu ,  Wei Jun Wang ,  Hong Min Huang

IPC分类号： C09K5/06 ,  H01L23/373 ,  C09K5/14

CPC分类号： C09K5/066 ,  C09K5/063 ,  C09K5/14 ,  H01L23/3737 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/73253

摘要： A thermal interface material includes, in one exemplary embodiment, a polymer, a phase change material, a first thermally conductive filler having a first particle size, and a second thermally conductive filler having a second particle size. The first particle size is larger than the second particle size. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.

公开(公告)号：US10287471B2

公开(公告)日：2019-05-14

申请号：US15531253

申请日：2014-12-05

申请人： Honeywell International Inc.

发明人： Liqiang Zhang ,  Ling Shen ,  Hui Wang ,  Ya Qun Liu ,  Wei Jun Wang ,  Hong Min Huang

IPC分类号： H01L23/373 ,  C09K5/06 ,  C09K5/14

摘要： A thermal interface material includes, in one exemplary embodiment, a polymer, a phase change material, a first thermally conductive filler having a first particle size, and a second thermally conductive filler having a second particle size. The first particle size is larger than the second particle size. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.

公开(公告)号：US10068830B2

公开(公告)日：2018-09-04

申请号：US15117862

申请日：2015-02-04

申请人： HONEYWELL INTERNATIONAL INC. ,  Liang Zeng ,  Ya Qun Liu ,  Jerry Chang ,  Bright Zhang ,  Zhe Ding ,  Wei Jun Wang ,  Hong Min Huang

发明人： Liang Zeng ,  Ya Qun Liu ,  Wei Chang ,  Liqiang Zhang ,  Zhe Ding ,  Wei Jun Wang ,  Hong Min Huang

IPC分类号： F28F7/00 ,  H01L23/373 ,  H01L23/42 ,  C09K5/06 ,  H01L23/367

CPC分类号： H01L23/3737 ,  C09K5/063 ,  H01L23/367 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

摘要： Provided is a compressible thermal interface material including a polymer, a thermally conductive filler, and a phase change material. A formulation for forming a compressible thermal interface material and an electronic component including a compressible thermal interface material are also provided.

公开(公告)号：US10106717B2

公开(公告)日：2018-10-23

申请号：US14590870

申请日：2015-01-06

申请人： Honeywell International Inc.

发明人： Jeffrey Han ,  Wei Jun Wang

IPC分类号： C09K5/06 ,  A41D1/00

摘要： Composite phase change materials, methods for manufacturing composite phase change materials, and articles of clothing including composite phase change materials for temperature regulation are provided. In one example, a composite phase change material includes a cross-linked polyethylene glycol matrix and a phase change material filler. Each of the cross-linked polyethylene glycol matrix and the phase change material filler has a phase change temperature of from about 10 to about 60° C. Further, the composite phase change material has a latent heat of enthalpy greater than about 50 kJ/kg.

公开(公告)号：US20180030328A1

公开(公告)日：2018-02-01

申请号：US15642092

申请日：2017-07-05

申请人： Honeywell International Inc.

发明人： Liqiang Zhang ,  Kai Zhang ,  Ling Shen ,  Ya Qun Liu ,  Wei Jun Wang ,  Haigang Kang

IPC分类号： C09K5/14 ,  H05K7/20 ,  C08K3/22

CPC分类号： C09K5/14 ,  C08G77/26 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2003/2296 ,  C08K2201/001 ,  C08K2201/014 ,  C08L83/04 ,  H05K7/2039 ,  C08K5/5419 ,  C08L83/00

摘要： A thermal interface material includes at least one polysiloxane; at least one thermally conductive filler; and at least one adhesion promoter including both amine and alkyl functional groups.

公开(公告)号：US20170018481A1

公开(公告)日：2017-01-19

申请号：US15117862

申请日：2015-02-04

申请人： Liang ZENG ,  Ya Qunn LIU ,  Jerry CHANG ,  Zhe DING ,  Wei Jun WANG ,  Hong Min HUANG ,  HONEYWELL INTERNATIONAL INC. ,  Bright ZHANG

发明人： Liang Zeng ,  Ya Qun Liu ,  Wei Chang ,  Liqiang Zhang ,  Zhe Ding ,  Wei Jun Wang ,  Hong Min Huang

IPC分类号： H01L23/373 ,  C09K5/06 ,  H01L23/367

CPC分类号： H01L23/3737 ,  C09K5/063 ,  H01L23/367 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

摘要： Provided is a compressible thermal interface material including a polymer, a thermally conductive filler, and a phase change material. A formulation for forming a compressible thermal interface material and an electronic component including a compressible thermal interface material are also provided.

摘要翻译： 提供了包括聚合物，导热填料和相变材料的可压缩热界面材料。 还提供了用于形成可压缩热界面材料的配方和包括可压缩热界面材料的电子部件。

公开(公告)号：US20150197678A1

公开(公告)日：2015-07-16

申请号：US14590870

申请日：2015-01-06

申请人： Honeywell International Inc.

发明人： Jeffrey Han ,  Wei Jun Wang

IPC分类号： C09K5/06 ,  A41D1/00

CPC分类号： C09K5/063

摘要： Composite phase change materials, methods for manufacturing composite phase change materials, and articles of clothing including composite phase change materials for temperature regulation are provided. In one example, a composite phase change material includes a cross-linked polyethylene glycol matrix and a phase change material filler. Each of the cross-linked polyethylene glycol matrix and the phase change material filler has a phase change temperature of from about 10 to about 60° C. Further, the composite phase change material has a latent heat of enthalpy greater than about 50 kJ/kg.

摘要翻译： 提供了复合相变材料，复合相变材料的制造方法，以及包括用于温度调节的复合相变材料的衣物。 在一个实例中，复合相变材料包括交联聚乙二醇基体和相变材料填料。 每个交联聚乙二醇基质和相变材料填料的相变温度为约10至约60℃。此外，复合相变材料的焓潜热大于约50kJ / kg 。