公开(公告)号：US20180022957A1

公开(公告)日：2018-01-25

申请号：US15522419

申请日：2016-03-02

申请人： Honeywell International Inc.

发明人： Desaraju Varaprasad ,  Sudip Mukhopadhyay ,  Songyuan Xie ,  Amanuel H. Gebrehrhan ,  Hai Bien

IPC分类号： C09D183/04 ,  C08J3/24

CPC分类号： C09D183/04 ,  C08G77/80 ,  C08J3/24 ,  C08J2383/04 ,  C08J2483/04 ,  C08K5/16 ,  C08K5/0025 ,  C08L83/00

摘要： A crosslinkable composition includes a first silicon-containing resin comprising alkyl groups and alkyl groups and a second silicon-containing resin comprising alkyl groups. The first silicon-containing resin has a weight average molecular weight from 1000 AMU to 10,000 AMU. The second silicon-containing resin has a weight average molecular weight from 900 AMU to 5000 AMU. The composition further includes at least one solvent and at least one heat-activated catalyst.

公开(公告)号：US10544329B2

公开(公告)日：2020-01-28

申请号：US15522419

申请日：2016-03-02

申请人： Honeywell International Inc.

发明人： Desaraju Varaprasad ,  Sudip Mukhopadhyay ,  Songyuan Xie ,  Amanuel H. Gebrehrhan ,  Hai Bien

IPC分类号： C09D183/04 ,  C08J3/24

摘要： A crosslinkable composition includes a first silicon-containing resin comprising alkyl groups and alkyl groups and a second silicon-containing resin comprising alkyl groups. The first silicon-containing resin has a weight average molecular weight from 1000 AMU to 10,000 AMU. The second silicon-containing resin has a weight average molecular weight from 900 AMU to 5000 AMU. The composition further includes at least one solvent and at least one heat-activated catalyst.