公开(公告)号：US12002692B2

公开(公告)日：2024-06-04

申请号：US17507932

申请日：2021-10-22

Applicant: Hitachi High-Tech Corporation

Inventor： Ryoichi Isomura ,  Keitarou Ogawa ,  Takahiro Sakuragi

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67184 ,  H01L21/67017 ,  H01L21/67161 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67742

Abstract: According to one embodiment, a vacuum processing device is provided which is capable of being controlled to create the most suitable gas flow under the situation where the device is placed by allowing a plurality of vacuum transfer chambers to communicate with each other via the intermediate chamber in an operation method of the vacuum processing device including the plurality of vacuum transfer chambers connected to each other via the intermediate chamber and a plurality of vacuum processing chambers respectively connected to the vacuum transfer chambers.

公开(公告)号：US20240047179A1

公开(公告)日：2024-02-08

申请号：US17641886

申请日：2021-05-27

Applicant: Hitachi High-Tech Corporation

Inventor： Kentaro Kiyosue ,  Kohei Sato ,  Ryoichi Isomura ,  Koji Nagai ,  Tsutomu Matsuyoshi

IPC: H01J37/32

CPC classification number: H01J37/32449

Abstract: A plasma treatment apparatus includes a treatment chamber 2 and a gas supply device 30 for supplying a treatment gas into the treatment chamber 2. The gas supply device 30 includes: a mass flow controller box 40 having an intake port 41 and an exhaust port 42; a plurality of pipes 43 to each of which a mass flow controller (43a) is attached; and a plurality of pipes 52 which are connected to the pipes 43 in the mass flow controller box 40 and connected to a plurality of pipes 54 as supply sources of the treatment gas by a plurality of joints 53 outside the mass flow controller box. At least one of the joints 53 is covered by a pipe cover 60 so that the joint 53 is hermetically sealed. The inside of the pipe cover 60 and the inside of the mass flow controller box 40 are communicated by a communicating member (circumferential pipe 61, tube 62).

公开(公告)号：US11195733B2

公开(公告)日：2021-12-07

申请号：US16362002

申请日：2019-03-22

Applicant: HITACHI HIGH-TECH CORPORATION

Inventor： Ryoichi Isomura ,  Keitarou Ogawa ,  Takahiro Sakuragi

IPC: H01L21/67 ,  H01L21/677

Abstract: According to one embodiment, a vacuum processing device is provided which is capable of being controlled to create the most suitable gas flow under the situation where the device is placed by allowing a plurality of vacuum transfer chambers to communicate with each other via the intermediate chamber in an operation method of the vacuum processing device including the plurality of vacuum transfer chambers connected to each other via the intermediate chamber and a plurality of vacuum processing chambers respectively connected to the vacuum transfer chambers.

公开(公告)号：US12112922B2

公开(公告)日：2024-10-08

申请号：US17641886

申请日：2021-05-27

Applicant: Hitachi High-Tech Corporation

Inventor： Kentaro Kiyosue ,  Kohei Sato ,  Ryoichi Isomura ,  Koji Nagai ,  Tsutomu Matsuyoshi

IPC: H01J37/32 ,  H05H1/46

CPC classification number: H01J37/32449

Abstract: A plasma treatment apparatus includes a treatment chamber 2 and a gas supply device 30 for supplying a treatment gas into the treatment chamber 2. The gas supply device 30 includes: a mass flow controller box 40 having an intake port 41 and an exhaust port 42; a plurality of pipes 43 to each of which a mass flow controller (43a) is attached; and a plurality of pipes 52 which are connected to the pipes 43 in the mass flow controller box 40 and connected to a plurality of pipes 54 as supply sources of the treatment gas by a plurality of joints 53 outside the mass flow controller box. At least one of the joints 53 is covered by a pipe cover 60 so that the joint 53 is hermetically sealed. The inside of the pipe cover 60 and the inside of the mass flow controller box 40 are communicated by a communicating member (circumferential pipe 61, tube 62).

公开(公告)号：US11600472B2

公开(公告)日：2023-03-07

申请号：US15902837

申请日：2018-02-22

Applicant: HITACHI HIGH-TECH CORPORATION

Inventor： Ryoichi Isomura ,  Yuusaku Sakka ,  Kouhei Satou ,  Takashi Uemura ,  Satoshi Yamamoto ,  Hiromichi Kawasaki

IPC: H01J37/18 ,  H01J37/32 ,  H01J37/34 ,  H01L21/67 ,  H01L21/677 ,  H01L21/687

Abstract: There is provided a vacuum processing apparatus in which at least one of the processing units includes a lower member and an upper member mounted on the lower member to be attachable and detachable that configure the vacuum container, a turning shaft member which is attached to an outer circumferential part of the base plate between the work space and the vacuum container, and has a turning shaft that moves from above the base plate when the turning shaft is connected to the lower member and the lower member turns around the connected part, and a maintenance member including an arm which is disposed above the turning shaft member and turns in a horizontal direction as the upper member is suspended, and in which the lower member is configured to be fixable at the position at a predetermined angle within a range of an angle at which the lower member is capable of turning around the shaft, and to be vertically movable as the arm of the maintenance member fixes the position above a center portion of the lower member of which the position is fixed within a range of the angle at which the lower member is capable of turning, and the upper member is suspended.