公开(公告)号：US11420282B2

公开(公告)日：2022-08-23

申请号：US16305705

申请日：2017-11-27

申请人： Hitachi, Ltd.

发明人： Miki Hiraoka ,  Shinya Kawakita ,  Masayuki Kyoi ,  Osamu Ikeda

IPC分类号： B23K3/00 ,  B23K3/06 ,  B23K3/02 ,  B23K3/04

摘要： A soldering device capable of shortening operation time of soldering and suppressing solder non-wetting is provided. A soldering device includes: a plurality of tubular solder piece guide tubes which have space therein for a solder piece supplied from a supply port to pass through; a first holding unit which holds the solder piece guide tubes; and a heating unit which heats the first holding unit. Tip end portions of the solder piece guide tubes on a soldering side are arranged on an inner side of the first holding unit.