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公开(公告)号:US20030169060A1
公开(公告)日:2003-09-11
申请号:US10379555
申请日:2003-03-06
Applicant: Hitachi, Ltd.
Inventor: Hiroyuki Shinada , Mari Nozoe , Haruo Yoda , Kimiaki Ando , Katsuhiro Kuroda , Yutaka Kaneko , Maki Tanaka , Shunji Maeda , Hitoshi Kubota , Aritoshi Sugimoto , Katsuya Sugiyama , Atsuko Takafuji , Yusuke Yajima , Hiroshi Tooyama , Tadao Ino , Takashi Hiroi , Kazushi Yoshimura , Yasutsugu Usami
IPC: G01R031/305
CPC classification number: G01R31/305 , G01R31/307 , H01J37/28 , H01J2237/2817
Abstract: A circuit pattern inspection method and an apparatus therefor, in which the whole of a portion to be inspected of a sample to be inspected is made to be in a predetermined charged state, the portion to be inspected is irradiated with an image-forming high-density electron beam while scanning the electron beam, secondary charged particles are detected at a portion irradiated with the electron beam after a predetermined period of time from an instance when the electron beam is radiated, an image is formed on the basis of the thus detected secondary charged particle signal, and the portion to be inspected is inspected by using the thus formed image.
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2.
公开(公告)号:US20020027440A1
公开(公告)日:2002-03-07
申请号:US09983703
申请日:2001-10-25
Applicant: Hitachi, Ltd.
Inventor: Hiroyuki Shinada , Mari Nozoe , Haruo Yoda , Kimiaki Ando , Katsuhiro Kuroda , Yutaka Kaneko , Maki Tanaka , Shunji Maeda , Hitoshi Kubota , Aritoshi Sugimoto , Katsuya Sugiyama , Atsuko Takafuji , Yusuke Yajima , Hiroshi Tooyama , Tadao Ino , Takashi Hiroi , Kazushi Yoshimura , Yasutsugu Usami
IPC: G01R031/305
CPC classification number: G01R31/305 , G01R31/307 , H01J37/28 , H01J2237/2817
Abstract: A circuit pattern inspection method and an apparatus therefor, in which the whole of a portion to be inspected of a sample to be inspected is made to be in a predetermined charged state, the portion to be inspected is irradiated with an image-forming high-density electron beam while scanning the electron beam, secondary charged particles are detected at a portion irradiated with the electron beam after a predetermined period of time from an instance when the electron beam is radiated, an image is formed on the basis of the thus detected secondary charged particle signal, and the portion to be inspected is inspected by using the thus formed image.
Abstract translation: 一种电路图案检查方法及其装置,其中待检查样品的待检查部分的整个部分被制成处于预定的充电状态,被检查的部分用图像形成高分辨率照射, 在扫描电子束的同时,在从电子束照射的时刻起经过规定的时间后,在用电子束照射的部分检测到二次带电粒子,根据这样检测出的次级 通过使用如此形成的图像来检查带电粒子信号,并检查待检查的部分。
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