公开(公告)号：US20110244619A1

公开(公告)日：2011-10-06

申请号：US13159887

申请日：2011-06-14

Applicant: Hirochika NARITA

Inventor： Hirochika NARITA

IPC: H01L31/18

CPC classification number: H01L27/14618 ,  H01L31/024 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A solid-state imaging device with an improved heat release-ability for releasing a heat generated in the amplifier unit of the solid-state image sensing element. The solid-state imaging device 10 of the present invention includes an elongated substrate (molded case 18), a metallic layer 16 exposed in a surface of the molded case 18 and extending along an elongating direction of the molded case 18, and an elongated solid-state image sensing element 20 mounted on the metallic layer 16, in which a thickness in a region of a metallic layer 16 right under an amplifier unit of the solid-state image sensing element 20 is larger than thicknesses in other regions of the metallic layer 16.

Abstract translation: 一种具有改善的放热能力的固态成像装置，用于释放在固体摄像元件的放大器单元中产生的热量。 本发明的固态成像装置10包括细长基板（模制壳体18），暴露在模制壳体18的表面并沿着模制壳体18的延伸方向延伸的金属层16和细长固体 安装在金属层16上的状态图像感测元件20，其中位于固态图像感测元件20的放大器单元正下方的金属层16的区域中的厚度大于金属层的其它区域中的厚度 16。

公开(公告)号：US20090224394A1

公开(公告)日：2009-09-10

申请号：US12390714

申请日：2009-02-23

Applicant: Hirochika NARITA

Inventor： Hirochika NARITA

IPC: H01L23/48 ,  H04N5/335

CPC classification number: H04N1/03 ,  H01L23/49541 ,  H01L23/49544 ,  H01L23/49555 ,  H01L24/48 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/16195 ,  H04N2201/02456 ,  H04N2201/02466 ,  H04N2201/02483 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10689 ,  H05K2201/10757 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Warpage and twist of a solid-state image sensing apparatus is controlled, thereby preventing displacement occurring to the solid-state image sensing apparatus when it is mounted on a printed circuit board. The solid-state image sensing apparatus comprises a plurality of outer leads, and the outer leads each comprises a horizontal portion protruding in the horizontal direction from a side face of a package body for encasing a solid-state image sensing chip therein, an end portion extending in a direction orthogonal to the horizontal portion, and disposed directly below the horizontal portion, a mid portion positioned between the horizontal portion, and the end portion, a first bend formed between the horizontal portion, and the mid portion, and a second bend formed between the mid portion, and the end portion.

Abstract translation: 控制固态图像感测装置的翘曲和扭曲，从而防止固体摄像装置安装在印刷电路板上时产生的位移。 固体摄像装置包括多个外部引线，外部引线各自包括水平部分，该水平部分从封装体的侧面在水平方向上突出，用于将固态图像感测芯片包封在其中，端部 在垂直于水平部分的方向上延伸并且设置在水平部分正下方，位于水平部分和端部之间的中间部分，形成在水平部分和中间部分之间的第一弯曲部分和第二弯曲部分 形成在中间部分和端部之间。