公开(公告)号：US09436988B2

公开(公告)日：2016-09-06

申请号：US14325802

申请日：2014-07-08

Applicant: Hermes-Microvision, Inc.

Inventor： Wei Fang ,  Zhaoli Zhang ,  Jack Jau

IPC: G06K9/00 ,  G06T7/00

CPC classification number: G06T7/0008 ,  G06T7/001 ,  G06T2207/20081 ,  G06T2207/30148

Abstract: A method of classifying the defects on a wafer having some same chips and corresponding system is provided. After receiving images formed by scanning the wafer using a charged particle beam, these images are examined such that both defective images and defect-free images are found. Then, the defect-free images are translated into a simulated layout of the chip, or a database is used to provide the simulated layout of the chip. Finally, the defects on the defective images are classified by comparing the images with the simulated layout of the chip. The system has some modules separately corresponds to the steps of the method.

Abstract translation: 提供了在具有相同芯片和相应系统的晶片上分类缺陷的方法。 在接收到通过使用带电粒子束扫描晶片形成的图像之后，检查这些图像，使得发现缺陷图像和无缺陷图像。 然后，将无缺陷图像转换为芯片的模拟布局，或者使用数据库来提供芯片的模拟布局。 最后，通过将图像与芯片的模拟布局进行比较来分类缺陷图像上的缺陷。 系统有一些模块分别对应于该方法的步骤。