公开(公告)号：US12052813B2

公开(公告)日：2024-07-30

申请号：US17943980

申请日：2022-09-13

Applicant: Hamilton Sundstrand Corporation

Inventor： Francis C. Belisle ,  Robert C. Cooney ,  Catherine Canciamille ,  Nhia Yang

IPC: H05K1/02 ,  H05K1/18 ,  H05K7/14

CPC classification number: H05K1/0203 ,  H05K1/0271 ,  H05K1/182 ,  H05K7/1407

Abstract: A circuit mounting assembly can include a circuit board, a chassis, a sheet of thermally conductive dielectric material, and one or more fasteners configured to compress the sheet between the circuit board and the chassis to provide vibration isolation and electrical isolation between the chassis and the circuit board, and to provide thermal conduction between the chassis and the circuit board.

公开(公告)号：US20240090115A1

公开(公告)日：2024-03-14

申请号：US17943980

申请日：2022-09-13

Applicant: Hamilton Sundstrand Corporation

Inventor： Francis C. Belisle ,  Robert C. Cooney ,  Catherine Canciamille ,  Nhia Yang

IPC: H05K1/02 ,  H05K1/18 ,  H05K7/14

CPC classification number: H05K1/0203 ,  H05K1/0271 ,  H05K1/182 ,  H05K7/1407

Abstract: A circuit mounting assembly can include a circuit board, a chassis, a sheet of thermally conductive dielectric material, and one or more fasteners configured to compress the sheet between the circuit board and the chassis to provide vibration isolation and electrical isolation between the chassis and the circuit board, and to provide thermal conduction between the chassis and the circuit board.