公开(公告)号：US11539150B2

公开(公告)日：2022-12-27

申请号：US17135736

申请日：2020-12-28

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hong Wu ,  Zhen Lv

IPC: H01R12/58 ,  H01R12/70 ,  H01R43/02 ,  H01R43/24

Abstract: Methods and apparatuses to provide a pin, a pin combination structure and a package body are described. A baffle structure is sleeved on the pin. The baffle structure is used to prevent a plastic packaging material from overflowing from a cavity that accommodates the plastic packaging material. The cavity is in a mold for packaging the package body.

公开(公告)号：US20230230928A1

公开(公告)日：2023-07-20

申请号：US18189622

申请日：2023-03-24

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Huibin Chen ,  Yongzhao Lin ,  Zhen Lv

IPC: H01L23/538 ,  H01L23/00

CPC classification number: H01L23/5386 ,  H01L23/5383 ,  H01L24/48 ,  H01L2224/48157

Abstract: A substrate, a packaged structure, and an electronic device are provided. The substrate is configured to be electrically connected to a chip. The chip includes a power terminal and a signal terminal. The substrate includes a first substrate and a second substrate mounted on the first substrate. The first substrate includes a first layout, and the first layout is configured to be electrically connected to the power terminal. The second substrate includes a second layout, and the second layout is configured to be electrically connected to the signal terminal. A spacing between lines of the second layout is less than a spacing between lines of the first layout. The substrate provided in this application has a small size and high integration.