公开(公告)号：US20220110224A1

公开(公告)日：2022-04-07

申请号：US17552722

申请日：2021-12-16

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Xinhu GONG ,  Gaoliang XIA

IPC: H05K7/20

Abstract: A heat dissipation apparatus includes a heat-conducting plate, where a liquid channel is disposed on a first surface of the heat-conducting plate; a mounting base, where an accommodation cavity configured to accommodate a partial area that is in the heat-conducting plate and that includes a second surface is disposed on the mounting base. The first surface and the second surface are disposed opposite to each other. A pressing plate is configured to fasten the heat-conducting plate in the accommodation cavity. The pressing plate is detachably and firmly connected to the mounting base, a sealing cavity is formed between the pressing plate and the first surface of the heat-conducting plate, and the sealing cavity is configured to accommodate the liquid channel A liquid inlet connector and a liquid outlet connector that are connected to the liquid channel are disposed on the pressing plate.

公开(公告)号：US20240164052A1

公开(公告)日：2024-05-16

申请号：US18418434

申请日：2024-01-22

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Xinhu GONG ,  Gaoliang XIA

IPC: H05K7/20 ,  H01L23/473

CPC classification number: H05K7/20254 ,  H01L23/473 ,  H05K7/20272

Abstract: A heat dissipation apparatus includes a heat-conducting plate, where a liquid channel is disposed on a first surface of the heat-conducting plate; a mounting base, where an accommodation cavity configured to accommodate a partial area that is in the heat-conducting plate and that includes a second surface is disposed on the mounting base. The first surface and the second surface are disposed opposite to each other. A pressing plate is configured to fasten the heat-conducting plate in the accommodation cavity. The pressing plate is detachably and firmly connected to the mounting base, a sealing cavity is formed between the pressing plate and the first surface of the heat-conducting plate, and the sealing cavity is configured to accommodate the liquid channel A liquid inlet connector and a liquid outlet connector that are connected to the liquid channel are disposed on the pressing plate.

公开(公告)号：US20220015268A1

公开(公告)日：2022-01-13

申请号：US17486593

申请日：2021-09-27

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yiying JIAN ,  Dingfang LI ,  Xinhu GONG ,  Gaoliang XIA

IPC: H05K7/20

Abstract: The present disclosure relates to heat dissipation apparatus. One example heat dissipation apparatus includes a heat dissipation assembly and a bracket assembly, where the heat dissipation assembly is configured to dissipate heat for a server chip and includes a substrate and a heat sink, the heat dissipation assembly is connected to the bracket assembly, the bracket assembly includes a bracket and a plurality of first elastic structural members that are disposed on the bracket, each first elastic structural member includes a supporting portion and a connection portion, and at least one hook is disposed on the connection portion.

公开(公告)号：US20230239995A1

公开(公告)日：2023-07-27

申请号：US18191946

申请日：2023-03-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hui JIA ,  Xinhu GONG ,  Dingfang LI

IPC: H05K1/02

CPC classification number: H05K1/021 ,  H05K1/0204

Abstract: A heat sink includes: a first heat dissipation module in thermal contact with the first heat source; a heat dissipation base in thermal contact with the second heat source, where the heat dissipation base is fixed on the circuit board, the first heat dissipation module is floatingly fixed on the heat dissipation base, and the heat dissipation base is provided with a first opening; and a second heat dissipation module, disposed between the first heat dissipation module and the heat dissipation base, where the second heat dissipation module is fixed on the heat dissipation base, the second heat dissipation module is provided with a second opening corresponding to the first opening, and the first heat dissipation module sequentially runs through the second opening and the first opening to be in thermal contact with the first heat source.

公开(公告)号：US20220181810A1

公开(公告)日：2022-06-09

申请号：US17680659

申请日：2022-02-25

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Huahua XU ,  Xinhu GONG ,  Yinzhong TANG

IPC: H01R12/72 ,  H05K7/14

Abstract: A circuit board assembly, a backplane interconnection system, and an electronic device are disclosed. The circuit board assembly includes a bracket and a circuit board, the circuit board is formed with a fastened part and a free part, the fastened part is connected to the bracket, the free part is suspended, a surface on which the free part and the fastened part are co-located is a first plane, the free part has an amplitude of swing in a first direction, the first direction is perpendicular to the first plane, the circuit board is configured to plug-connect to a front sub-circuit board, a first connector plug-connected to a first plug-connection end on the front sub-circuit board is disposed on the free part, and the amplitude of swing is capable of enabling the first connector to plug-connect to the first plug-connection end.