公开(公告)号：US20240194562A1

公开(公告)日：2024-06-13

申请号：US18542764

申请日：2023-12-17

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Le Kang ,  Xiaoguo Liu ,  Lingcheng Yuan ,  Bin Xu ,  Zhiqiang He

IPC: H01L23/42 ,  H01L21/48 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L23/42 ,  H01L21/4846 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386

Abstract: This application provides a die package structure including a package substrate, a die, and a first package body. The package substrate has a first surface and a second surface opposite each other. The die is coupled to the package substrate, and the die has a hotspot. A heat dissipation connection point is disposed on the first surface of the package substrate, and a heat conduction channel that communicates the heat dissipation connection point with the hotspot is formed in the package substrate. A first connection terminal for connecting to an external device is disposed on the second surface. The first package body is disposed on the first surface, a heat conduction structure is formed in the first package body, and the heat conduction structure extends from the heat dissipation connection point to a surface of the first package body.