公开(公告)号：US11605901B2

公开(公告)日：2023-03-14

申请号：US17150320

申请日：2021-01-15

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Xianfeng Tang ,  Yu Liu ,  Kun Li

IPC: H01Q19/13 ,  H01Q19/08 ,  H01Q1/24 ,  H01Q3/46 ,  H01Q19/19

Abstract: A beam reconstruction method includes: generating or receiving a radio frequency signal, determining a to-be-adjusted beam angle, loading a voltage bias value on each liquid crystal metasurface array unit among a plurality of liquid crystal metasurface array units in a liquid crystal metasurface array based on the beam angle, and either emitting the generated radio frequency signal transmitted through the liquid crystal metasurface array or directing the received radio frequency signal through the liquid crystal metasurface array to a feed of an antenna. A lateral offset of a feed phase center is generated based on the voltage bias value after the radio frequency signal is transmitted through the liquid crystal metasurface array.

公开(公告)号：US20230318166A1

公开(公告)日：2023-10-05

申请号：US18180085

申请日：2023-03-07

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Luqi Zhang ,  Kun Li ,  Xianfeng Tang ,  Yanxing Luo

IPC: H01Q1/22 ,  H01Q9/04 ,  H01Q1/38 ,  H01Q1/50

CPC classification number: H01Q1/2283 ,  H01Q1/38 ,  H01Q1/50 ,  H01Q9/0407

Abstract: This disclosure provides a radio frequency chip, a signal transceiver, and a communication device. The radio frequency chip includes: a chip; a coupling structure, including: a resonator, where a resonant cavity is formed, and an inner wall of the resonant cavity is made of metal; a redistribution layer, arranged above the resonant cavity and including an redistribution layer (RDL) dielectric layer; a radiator, made of metal, formed into a centro-symmetric shape, arranged on a surface that is of the dielectric layer and that faces the resonator, and accommodated in the resonant cavity; a feeder, where one end of the feeder is connected to the chip, and the other end is inserted into the resonant cavity; a packaging structure, configured to package the chip and cover the redistribution layer, so that a signal generated by the chip can be efficiently coupled to a polymer transmission line.