公开(公告)号：US20240222888A1

公开(公告)日：2024-07-04

申请号：US18607295

申请日：2024-03-15

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Shuzhao Cao ,  Shuang Qiu ,  Xichen Yang ,  Jie Zhang

IPC: H01R12/57 ,  H01R12/72 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34

CPC classification number: H01R12/57 ,  H01R12/722 ,  H05K1/112 ,  H05K3/0026 ,  H05K3/3405 ,  H05K2201/10734

Abstract: A connector includes a base structure in one embodiment. At least one first via hole is disposed between a first surface and second surface of the base structure. The first surface has a first metal layer and a first clearance region that is in one-to-one correspondence with the at least one first via hole. The first clearance region is of a ring-shaped structure. The first via hole is located in a region encircled by the corresponding first clearance region. The first clearance region does not overlap the first metal layer. The second surface has a second metal layer and a second clearance region that is in one-to-one correspondence with the at least one first via hole. The second clearance region is of a ring-shaped structure. The first via hole is located in a region encircled by the corresponding second clearance region. The second clearance region does not overlap the second metal layer.