Connection plate, circuit board assembly, and electronic device

    公开(公告)号:US11706871B2

    公开(公告)日:2023-07-18

    申请号:US17487988

    申请日:2021-09-28

    Abstract: An circuit board assembly includes a first circuit board, a second circuit board stacked with the first circuit board, and a connection plate connected between the first circuit board and the second circuit board. The connection plate includes a signal transmission part and at least one ground part at a spacing to the signal transmission part. The ground part can be used as a reference ground for a signal transmitted by the signal transmission part, so that the characteristic impedance of the signal transmission part is controllable, and the signal transmitted by the signal transmission part has strong continuity, thereby maintaining good matching performance and reducing an insertion loss caused by characteristic impedance mismatch.

    Signal processing method and communications chip structure

    公开(公告)号:US10904054B2

    公开(公告)日:2021-01-26

    申请号:US16750200

    申请日:2020-01-23

    Abstract: This application discloses a communications chip structure, including: a channel selection module, configured to receive an input signal, where the input signal is a signal of a preset narrow bandwidth span or a signal of a preset wide bandwidth span; and a digital baseband module, configured to control the channel selection module to select a first sampling and quantification channel when the input signal is a signal of the preset narrow bandwidth span, or control the channel selection module to select a second sampling and quantification channel when the input signal is a signal of the preset wide bandwidth span. The channel selection module is further configured to send the input signal to the first sampling and quantification channel or the second sampling and quantification channel for sampling and quantification.

    Connection plate, circuit board assembly, and electronic device

    公开(公告)号:US11166374B2

    公开(公告)日:2021-11-02

    申请号:US16980174

    申请日:2018-03-15

    Abstract: An electronic device includes a first circuit board, a second circuit board stacked with the first circuit board, and a connection plate connected between the first circuit board and the second circuit board. The connection plate includes a signal transmission part and at least one ground part at a spacing to the signal transmission part. The ground part can be used as a reference ground for a signal transmitted by the signal transmission part, so that the characteristic impedance of the signal transmission part is controllable, and the signal transmitted by the signal transmission part has strong continuity, thereby maintaining good matching performance and reducing an insertion loss caused by characteristic impedance mismatch.

    SIGNAL PROCESSING METHOD AND COMMUNICATIONS CHIP STRUCTURE

    公开(公告)号:US20200162294A1

    公开(公告)日:2020-05-21

    申请号:US16750200

    申请日:2020-01-23

    Abstract: This application discloses a communications chip structure, including: a channel selection module, configured to receive an input signal, where the input signal is a signal of a preset narrow bandwidth span or a signal of a preset wide bandwidth span; and a digital baseband module, configured to control the channel selection module to select a first sampling and quantification channel when the input signal is a signal of the preset narrow bandwidth span, or control the channel selection module to select a second sampling and quantification channel when the input signal is a signal of the preset wide bandwidth span. The channel selection module is further configured to send the input signal to the first sampling and quantification channel or the second sampling and quantification channel for sampling and quantification.

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