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公开(公告)号：US20140076602A1
公开(公告)日：2014-03-20
申请号：US13622074
申请日：2012-09-18
CPC分类号： G04F5/14
摘要： A method of forming a physics package for an atomic sensor comprises providing a plurality of panels, with each of the panels having multiple edges, and assembling the panels in a three-dimensional multi-faced geometric configuration such that the edges of adjacent panels are aligned with each other. A sol-gel material is applied to the edges of the panels, and the sol-gel material is cured to hermetically seal adjacent panels together.
摘要翻译： 形成用于原子传感器的物理封装的方法包括提供多个面板，每个面板具有多个边缘，并且将面板组装成三维多面几何构型，使得相邻面板的边缘对准 与彼此。 将溶胶凝胶材料施加到面板的边缘，并且固化溶胶 - 凝胶材料以将相邻的面板密封在一起。
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2.发明申请公开(公告)号：US20140085014A1
公开(公告)日：2014-03-27
申请号：US13625512
申请日：2012-09-24
CPC分类号： G04F5/14
摘要： A method of forming a physics package for an atomic sensor comprises providing an expendable support structure having a three-dimensional configuration, providing a plurality of optical panels, and assembling the optical panels on the expendable support structure such that edges of adjacent panels are aligned with each other. The edges of adjacent panels are sealed together to form a physics block having a multifaced geometric configuration. The expendable support structure is then removed while leaving the physics block intact.
摘要翻译： 形成用于原子传感器的物理封装的方法包括提供具有三维构造的消耗性支撑结构，提供多个光学面板，以及将光学面板组装在消耗性支撑结构上，使得相邻面板的边缘与 彼此。 相邻板的边缘被密封在一起以形成具有多重几何构型的物理块。 然后移除消耗性支撑结构，同时保持物理块的完整性。
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3.发明授权Hermetically sealed atomic sensor package manufactured with expendable support structure 有权密封的原子传感器封装采用消耗性支撑结构制造公开(公告)号：US08710935B2
公开(公告)日：2014-04-29
申请号：US13625512
申请日：2012-09-24
IPC分类号： H03B17/00
CPC分类号： G04F5/14
摘要： A method of forming a physics package for an atomic sensor comprises providing an expendable support structure having a three-dimensional configuration, providing a plurality of optical panels, and assembling the optical panels on the expendable support structure such that edges of adjacent panels are aligned with each other. The edges of adjacent panels are sealed together to form a physics block having a multifaced geometric configuration. The expendable support structure is then removed while leaving the physics block intact.
摘要翻译： 形成用于原子传感器的物理封装的方法包括提供具有三维构造的消耗性支撑结构，提供多个光学面板，以及将光学面板组装在消耗性支撑结构上，使得相邻面板的边缘与 彼此。 相邻板的边缘被密封在一起以形成具有多重几何构型的物理块。 然后移除消耗性支撑结构，同时保持物理块的完整性。
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