发明授权
- 专利标题： Hermetically sealed atomic sensor package manufactured with expendable support structure
- 专利标题（中）： 密封的原子传感器封装采用消耗性支撑结构制造
-
申请号： US13625512申请日： 2012-09-24
-
公开(公告)号： US08710935B2公开(公告)日： 2014-04-29
- 发明人: Christina Marie Schober , Terry Dean Stark , Delmer L. Smith , James A. Vescera
- 申请人： Honeywell International Inc.
- 申请人地址： US NJ Morristown
- 专利权人： Honeywell International Inc.
- 当前专利权人： Honeywell International Inc.
- 当前专利权人地址： US NJ Morristown
- 代理机构： Fogg & Powers LLC
- 主分类号： H03B17/00
- IPC分类号： H03B17/00
摘要：
A method of forming a physics package for an atomic sensor comprises providing an expendable support structure having a three-dimensional configuration, providing a plurality of optical panels, and assembling the optical panels on the expendable support structure such that edges of adjacent panels are aligned with each other. The edges of adjacent panels are sealed together to form a physics block having a multifaced geometric configuration. The expendable support structure is then removed while leaving the physics block intact.
公开/授权文献
信息查询
