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公开(公告)号：US11858056B2
公开(公告)日：2024-01-02
申请号：US17183372
申请日：2021-02-24
发明人： Hiroki Tokuichi , Yuichi Hirata , Takanori Sato , Shin Yoshida
IPC分类号： B23K26/16 , B23K26/08 , B65G13/07 , B65G23/04 , B23K37/04 , B65G15/12 , B23K101/18 , B23K103/04
CPC分类号： B23K26/16 , B23K26/0838 , B23K37/0408 , B65G13/07 , B65G15/12 , B65G23/04 , B23K2101/18 , B23K2103/04
摘要： A laser processing apparatus 3 includes: a laser head H; a conveying device 4 that conveys a workpiece W; a head driving mechanism that moves the laser head H; a dust collecting box 60 that moves below the workpiece W and follows the laser head H such that the dust collecting box 60 is disposed below the laser head H; an outer support roller 81 and an inner support roller 82 that are provided at an opening 61 of the dust collecting boz 60 and are rotatable around an axis parallel to a width direction orthogonal to a conveying direction Fy; and a counter roller 9 that rotates the outer support roller 81 in synchronization with a conveying operation of the workpiece W by the conveying device 4. The counter roller 9 transmits motive power of the conveying device 4 as a belt conveyor to the outer support roller 81.
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公开(公告)号：US20130175750A1
公开(公告)日：2013-07-11
申请号：US13737342
申请日：2013-01-09
发明人： Takuo Kobayashi , Izuru Hori , Kenichi Fukami , Masahiro Koike , Shin Yoshida
IPC分类号： B23K37/04
CPC分类号： B23K37/04 , B23K37/0408
摘要： A workpiece support apparatus is provided with a plurality of support members. The support members support a workpiece. Each support member moves along a moving path to a machining position while the support member is held at a first holding position for supporting the workpiece or a second holding position which is spaced apart from the first holding position. At least one support member is displaced from the first holding position to the second holding position or from the second holding position to the first holding position along a machining trajectory, before the support member arrives at the machining position whenever each support member is moved to the machining position.
摘要翻译： 工件支撑装置设置有多个支撑构件。 支撑构件支撑工件。 每个支撑构件沿着移动路径移动到加工位置，同时支撑构件保持在用于支撑工件的第一保持位置或与第一保持位置间隔开的第二保持位置。 至少一个支撑构件在每个支撑构件移动到第一保持位置之前，沿着加工轨迹从第一保持位置移动到第二保持位置或从第二保持位置移位到第一保持位置，在支撑构件到达加工位置之前 加工位置。
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公开(公告)号：US09120185B2
公开(公告)日：2015-09-01
申请号：US13737342
申请日：2013-01-09
发明人： Takuo Kobayashi , Izuru Hori , Kenichi Fukami , Masahiro Koike , Shin Yoshida
IPC分类号： B23K37/04
CPC分类号： B23K37/04 , B23K37/0408
摘要： A workpiece support apparatus is provided with a plurality of support members. The support members support a workpiece. Each support member moves along a moving path to a machining position while the support member is held at a first holding position for supporting the workpiece or a second holding position which is spaced apart from the first holding position. At least one support member is displaced from the first holding position to the second holding position or from the second holding position to the first holding position along a machining trajectory, before the support member arrives at the machining position whenever each support member is moved to the machining position.
摘要翻译： 工件支撑装置设置有多个支撑构件。 支撑构件支撑工件。 每个支撑构件沿着移动路径移动到加工位置，同时支撑构件保持在用于支撑工件的第一保持位置或与第一保持位置间隔开的第二保持位置。 至少一个支撑构件在每个支撑构件移动到第一保持位置之前，沿着加工轨迹从第一保持位置移动到第二保持位置或从第二保持位置移位到第一保持位置，在支撑构件到达加工位置之前 加工位置。
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公开(公告)号：US11173573B2
公开(公告)日：2021-11-16
申请号：US15760847
申请日：2016-09-16
发明人： Takanori Sato , Shin Yoshida , Masahiro Koike , Kenichi Fukami
摘要： Provided are a laser processing method and a laser processing device which prevent a laser irradiation unit from colliding with an edge of a plate material when the laser irradiation unit returns to a portion just above the plate material from an outer part of the portion just above the plate material. The laser processing method for cutting a plate material by laser irradiation, the method including: a plate material end portion holding process of holding a position of an end portion of the plate material at a predetermined position when a laser irradiation unit is present outside a portion just above the plate material; and a laser irradiation unit moving process in which the laser irradiation unit moves from an outer part of the portion just above the plate material to the portion just above the plate material.
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公开(公告)号：US11839933B2
公开(公告)日：2023-12-12
申请号：US17183374
申请日：2021-02-24
发明人： Hiroki Tokuichi , Shin Yoshida , Takanori Sato , Yuichi Hirata , Naruhiko Okubo , Koki Mizutani
CPC分类号： B23K26/0838 , B23K26/0869 , B23K26/16 , B23K26/706
摘要： A laser processing apparatus 3 includes: a laser head H; a head driving mechanism that moves the laser head H above a workpiece W; and a dust collecting box 60 that moves below the workpiece W and follows the laser head H. A non-contact support unit 7 is provided at an opening 61 of the dust collecting box 60, and the non-contact support unit 7 suctions a lower surface of the workpiece W toward a suction surface 71 and supports the workpiece W without bringing the lower surface of the workpiece W and the suction surface 71 into contact with each other. An outer support roller 81 and an inner support roller 82 that are each rotatable about an axis parallel to a width direction orthogonal or substantially orthogonal to a conveying direction Fy are provided at the opening 61.
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