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公开(公告)号：US10468794B2
公开(公告)日：2019-11-05
申请号：US15569278
申请日：2015-07-30
发明人： Kevin Leigh , John Norton , George Megason
IPC分类号： H01R12/70 , G02B6/36 , H01R12/71 , H01R13/518 , H01R13/629 , G02B6/42
摘要： One example of a system includes a system board including first contacts and second contacts and a cage attached to the system board. The cage includes a first side over the first contacts and a second side over the second contacts. A first lever is coupled to the first side of the cage and pivotable with respect to the cage. A second lever is coupled to the second side of the cage and pivotable with respect to the cage. A removable transceiver module includes third contacts. The transceiver module is installable in at least one of the first side and the second side of the cage using at least one of the first lever and the second lever.
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公开(公告)号：US20160172773A1
公开(公告)日：2016-06-16
申请号：US15053412
申请日：2016-02-25
发明人： Kevin Leigh , George Megason
IPC分类号： H01R12/70
CPC分类号： H01R12/7076 , H01R12/712 , H01R12/714 , H05K3/325 , H05K7/1092 , H05K2201/0311 , H05K2201/10325 , H05K2201/10378 , H05K2201/10734
摘要： A socket (130) employs a substrate (310) including a conductive network. An array of first contacts (136) is on a top surface of the substrate (310) and arranged to engage an integrated circuit (110). An array of second contacts (138) is on a bottom surface of the substrate (310) and arranged to engage a circuit board (120). The conductive network electrically connects the first contacts (136) respectively to the second contacts (138), and the first contacts (136) include a routed first contact (136′) that the conductive network routes horizontally in or on the substrate (310).
摘要翻译： 插座（130）采用包括导电网络的基板（310）。 第一触点（136）的阵列位于衬底（310）的顶表面上并被布置成接合集成电路（110）。 第二触点阵列（138）位于基板（310）的底表面上并且布置成接合电路板（120）。 所述导电网络将所述第一触头（136）分别电连接到所述第二触点（138），并且所述第一触点（136）包括所述导电网络水平地在所述基板（310）中或所述基板（310）上的路由的第一触点（136'）， 。
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公开(公告)号：US20190098788A1
公开(公告)日：2019-03-28
申请号：US15718392
申请日：2017-09-28
发明人： Kevin B. Leigh , John R. Grady , George Megason
摘要： An example frame shuffle is communicatively coupled to a midplane of a frame. The frame shuffle includes a first group of optical connectors. Each of which are communicatively coupled to a resource device via the midplane. The frame shuffle also includes a second group of optical connectors, each of which communicatively couples with a frame shuffle of an adjacent frame. The frame shuffle also includes a routing device to optically interconnect the resource devices and another group of resource devices of the adjacent frame. The frame shuffle also includes a frame shuffle fan to provide fresh air through the frame shuffle and direct exhaust air through the midplane.
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公开(公告)号：US20180054922A1
公开(公告)日：2018-02-22
申请号：US15565945
申请日：2015-04-30
发明人： Kevin Leigh , George Megason
摘要： One example of a system includes a blade enclosure and a midplane within the blade enclosure. The midplane supports a first sleeve connector and a second sleeve connector, where each of the first and second sleeve connectors have a first side and a second side. A server blade installed in the blade enclosure includes an air duct coupled to the first side of the first sleeve connector. A cooling module including an air manifold is coupled to the second side of the first sleeve connector to deliver cool air to the air duct of the server blade.
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公开(公告)号：US10386590B2
公开(公告)日：2019-08-20
申请号：US15569326
申请日：2015-07-31
发明人： Kevin Leigh , George Megason , John Norton
IPC分类号： G02B6/12 , G02B6/42 , H01L23/373 , H01L25/065 , H01L23/367 , H01L23/40
摘要： One example of a multi-chip module includes a substrate, a semiconductor chip, and an optical transceiver. The substrate has a first side and a second side opposite the first side. The semiconductor chip is electrically coupled to the first side of the substrate. The optical transceiver is electrically coupled to the second side of the substrate.
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公开(公告)号：US09768536B2
公开(公告)日：2017-09-19
申请号：US15053412
申请日：2016-02-25
发明人： Kevin Leigh , George Megason
CPC分类号： H01R12/7076 , H01R12/712 , H01R12/714 , H05K3/325 , H05K7/1092 , H05K2201/0311 , H05K2201/10325 , H05K2201/10378 , H05K2201/10734
摘要： A socket (130) employs a substrate (310) including a conductive network. An array of first contacts (136) is on a top surface of the substrate (310) and arranged to engage an integrated circuit (110). An array of second contacts (138) is on a bottom surface of the substrate (310) and arranged to engage a circuit board (120). The conductive network electrically connects the first contacts (136) respectively to the second contacts (138), and the first contacts (136) include a routed first contact (136′) that the conductive network routes horizontally in or on the substrate (310).
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公开(公告)号：US10721843B2
公开(公告)日：2020-07-21
申请号：US15565945
申请日：2015-04-30
发明人： Kevin Leigh , George Megason
摘要： One example of a system includes a blade enclosure and a midplane within the blade enclosure. The midplane supports a first sleeve connector and a second sleeve connector, where each of the first and second sleeve connectors have a first side and a second side. A server blade installed in the blade enclosure includes an air duct coupled to the first side of the first sleeve connector. A cooling module including an air manifold is coupled to the second side of the first sleeve connector to deliver cool air to the air duct of the server blade.
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公开(公告)号：US20200088950A1
公开(公告)日：2020-03-19
申请号：US15749170
申请日：2015-07-31
发明人： Kevin B. Leigh , George Megason
IPC分类号： G02B6/38
摘要： An example electro-optical connector may comprise an optical ferrule to optically engage with a complementary optical ferrule on a complementary electro-optical connector, a first conductive guide post disposed adjacent to the optical ferrule to electrically engage with a first guide pocket of the complementary electro-optical connector, and a second conductive guide post disposed on an opposite side of the optical ferrule from the first conductive guide post and to electrically engage with a second guide pocket of the complementary electro-optical connector. The first and second conductive guide posts may align the optical ferrule for engagement with the complementary optical ferrule when the guide posts are engaged with the respective guide pockets, and the first and second conductive guide posts may conduct an electrical signal or electrical power from the electro-optical connector to the complementary electro-optical connector.
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公开(公告)号：US20180120525A1
公开(公告)日：2018-05-03
申请号：US15569326
申请日：2015-07-31
发明人： Kevin Leigh , George Megason , John Norton
IPC分类号： G02B6/42 , H01L23/373 , H01L25/065
CPC分类号： G02B6/4269 , G02B6/4201 , G02B6/4246 , G02B6/4274 , G02B6/428 , G02B6/4284 , H01L23/367 , H01L23/373 , H01L23/4006 , H01L25/0657 , H01L2924/14 , H01L2924/1433
摘要： One example of a multi-chip module includes a substrate, a semiconductor chip, and an optical transceiver. The substrate has a first side and a second side opposite the first side. The semiconductor chip is electrically coupled to the first side of the substrate. The optical transceiver is electrically coupled to the second side of the substrate.
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