公开(公告)号：US20150380455A1

公开(公告)日：2015-12-31

申请号：US14766336

申请日：2013-10-17

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Kenichi SUGIMOTO ,  Hiroya KOBAYASHI ,  Kentaro MAETA ,  Masaharu MURAMATSU

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  H01L23/49838 ,  H01L24/14 ,  H01L27/14601

Abstract: A plurality of semiconductor photodetecting elements have a planar shape having a pair of first sides opposed to each other in a first direction and a pair of second sides being shorter than the pair of first sides and opposed to each other in a second direction perpendicular to the first direction, and are disposed on a base so as to be adjacent to each other in juxtaposition. A plurality of bump electrodes each are disposed on sides where the pair of first sides lie in each semiconductor photodetecting element, to electrically and mechanically connect the base to each semiconductor photodetecting element. A plurality of dummy bumps are disposed so that at least one dummy bump is disposed on each of sides where the pair of second sides lie in each semiconductor photodetecting element, to mechanically connect the base to each semiconductor photodetecting element.

Abstract translation: 多个半导体光电检测元件具有平面形状，其具有在第一方向上彼此相对的一对第一边，并且一对第二边短于该对第一侧，并且在垂直于第一方向的第二方向上彼此相对 第一方向，并且以并置的方式彼此相邻地设置在基部上。 多个凸起电极分别设置在一对第一面位于各半导体光检测元件的侧面，以将基底电连接和机械地连接到每个半导体光电检测元件。 设置多个虚设凸点，使得至少一个虚设凸块设置在每对半导体光检测元件中的一对第二侧的每侧上，以将基底机械地连接到每个半导体光检测元件。