公开(公告)号：US10025047B1

公开(公告)日：2018-07-17

申请号：US15488237

申请日：2017-04-14

Applicant: Google Inc.

Inventor： Hong Liu ,  Ryohei Urata ,  Woon Seong Kwon ,  Teckgyu Kang

IPC: G02B6/42 ,  H05K3/30 ,  H01L23/00 ,  H01L25/16 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32

Abstract: Signal integrity in high-speed applications is dependent on both the underlying device performance and electronic packaging methods. The maturity of chip-on-board (COB) packaging technology using wire bonding makes it a cost beneficial option for the mass production of high-speed optical transceivers. However, wire bonding introduces parasitic inductance associated with the length of the bond wires that limits the scalability of the system for higher data throughput. A high-speed optical transceiver package according to a first proposed configuration minimizes packaging related parasitic inductance by vertically integrating components using flip-chip bonding. A high-speed optical transceiver package according to a second proposed configuration minimizes packaging related parasitic inductance with horizontal tiling of components using a chip carrier and flip-chip bonding.