LASER PROCESSING APPARATUS, LASER PROCESSING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD

    公开(公告)号:US20240173796A1

    公开(公告)日:2024-05-30

    申请号:US18399043

    申请日:2023-12-28

    CPC classification number: B23K26/066 H01L21/481 H01L24/16 H01L2224/16225

    Abstract: A laser processing apparatus forms a hole in a workpiece having a resin layer on a processing surface by irradiating the workpiece with a laser beam discharge-excited between a pair of discharge electrodes, and includes a laser apparatus that outputs the laser beam having a first divergence angle in a discharge direction between the pair of discharge electrodes larger than a second divergence angle in a direction perpendicular to the discharge direction and a laser beam traveling direction, a transfer mask that forms a transfer pattern, an introducing optical system for guiding the laser beam to the transfer mask, a projection optical system that images the transfer pattern on the resin layer, and a divergence angle adjusting optical system that is disposed on an optical path of the laser beam and adjusts a difference between the first divergence angle and the second divergence angle to be reduced.

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