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公开(公告)号:US20230057297A1
公开(公告)日:2023-02-23
申请号:US17797347
申请日:2021-01-26
发明人: Stephan FRAUNHOFER
IPC分类号: B32B37/10 , B32B7/12 , H01M50/164
摘要: The invention relates to a cover structure the SMC main body of which is simultaneously pressed and bonded with two additional layers in a bonding press.
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公开(公告)号:US20230352777A1
公开(公告)日:2023-11-02
申请号:US17796590
申请日:2021-01-26
发明人: Stephan FRAUNHOFER
IPC分类号: H01M50/143 , H01M50/164 , H01M50/159 , H01M50/16 , B29C70/18
CPC分类号: H01M50/143 , H01M50/164 , H01M50/159 , H01M50/16 , B29C70/18 , B29L2031/3468
摘要: The invention relates to a cover structure, an SMC mold as well as a method for producing a cover structure having an SMC main body which is pressed together with a flame retardant coating in an SMC mold.
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