公开(公告)号：US10660208B2

公开(公告)日：2020-05-19

申请号：US15209244

申请日：2016-07-13

Applicant: General Electric Company

Inventor： Christopher James Kapusta ,  Kaustubh Ravindra Nadarkar

IPC: H05K3/40 ,  H05K3/32 ,  H05K1/18 ,  H01M6/40 ,  H01M10/0585 ,  H01M10/0562 ,  H01L23/58 ,  H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01M10/04 ,  H01M2/20 ,  H01M10/42 ,  H01L21/48 ,  H01L21/56 ,  H01L23/66 ,  H05K1/02 ,  H05K1/11 ,  H01M10/0587 ,  H01L25/16 ,  H01M10/052

Abstract: A system and method for providing a packaged electronics module having a dry film battery incorporated therein is disclosed. The packaged electronics module includes a first dielectric layer, at least one electronic component attached to or embedded in the first dielectric layer, a dry film battery formed on the first dielectric layer, and metal interconnects mechanically and electrically coupled to the at least one electronic component and the dry film battery to form electrical interconnections thereto. Electronic components in the form of a MEMS type sensor, semiconductor device and communications device may be included in the module along with the battery to provide a self-powered module capable of communicating with other like packaged electronics modules.