-
公开(公告)号:US11090770B2
公开(公告)日:2021-08-17
申请号:US16302490
申请日:2016-05-18
Applicant: GENERAL ELECTRIC COMPANY
Inventor: Dheepa Srinivasan , Dayananda Narayana , Kaustubh Krishna Bawane , Joydeep Pal , Mariusz Strzyzewski , Tomasz Szewczyk , David Edward Schick
IPC: B23P6/00 , B22F5/04 , F01D5/00 , F01D5/18 , B23K26/342 , B22F7/06 , B22F7/08 , B23K26/14 , B23K26/144 , B22F10/20 , B23K101/00 , B23K103/18
Abstract: A component and method of forming a component are disclosed. The component includes a cast alloy section and an additive manufacturing section secured to the cast alloy section. Both the cast alloy section and the additive manufacturing section form at least a portion of an outer surface of the component. The method of forming a component includes removing a portion of an existing component, the removing of the portion forming an open section in the existing component, forming an article through an additive manufacturing technique, the article having a shape and geometry arranged and disposed to fill the open section in the existing component, and securing the article within the open section of the existing component to form the component. Another method includes directly depositing a material, by an additive manufacturing technique, over a portion of the existing component.
-
公开(公告)号:US10711636B2
公开(公告)日:2020-07-14
申请号:US14977833
申请日:2015-12-22
Applicant: General Electric Company
Inventor: Eklavya Calla , Joydeep Pal , Krishnamurthy Anand
Abstract: A system for coating a component is provided. The system includes a feedstock supply, a carrier fluid supply, and a thermal spray gun coupled in flow communication with the feedstock supply and the carrier fluid supply. The feedstock supply contains a substantially homogeneous powder mixture of a first powder and a second powder. The second powder is softer than the first powder and has a percentage by mass of the powder mixture of between about 0.1% and about 3.0%.
-
公开(公告)号:US20170175570A1
公开(公告)日:2017-06-22
申请号:US14977833
申请日:2015-12-22
Applicant: General Electric Company
Inventor: Eklavya Calla , Joydeep Pal , Krishnamurthy Anand
Abstract: A system for coating a component is provided. The system includes a feedstock supply, a carrier fluid supply, and a thermal spray gun coupled in flow communication with the feedstock supply and the carrier fluid supply. The feedstock supply contains a substantially homogeneous powder mixture of a first powder and a second powder. The second powder is softer than the first powder and has a percentage by mass of the powder mixture of between about 0.1% and about 3.0%.
-
公开(公告)号:US11224915B2
公开(公告)日:2022-01-18
申请号:US15970101
申请日:2018-05-03
Applicant: General Electric Company
Inventor: Dheepa Srinivasan , Joydeep Pal , M. Raghunandan , Rohit Sen , Sridhar Balaram , Mohamed Aleem
IPC: B22F7/06 , B22F5/04 , B22F7/02 , B33Y80/00 , B33Y10/00 , B33Y70/00 , B33Y40/00 , C22C1/04 , F01D5/28 , F01D5/00 , B23P6/00 , B22F7/08 , B22F10/20 , C22C19/07 , B33Y30/00 , B22F10/30
Abstract: A method for forming a secondary component from an original component having an original shape includes separating the original component into a parent component and a replaced portion, and forming a replacement coupon using an additive manufacturing system. The replacement coupon is shaped to substantially match the original shape of the replaced portion. The method further includes coupling the replacement coupon to the parent component to form the secondary component. The method also includes at least one of (i) removing the replacement coupon from a build plate of the additive manufacturing system prior to application of any heat treatment to the as-built replacement coupon, wherein the replacement coupon maintains a near-net original shape of the replaced portion after removal, and (ii) entering the secondary component into normal duty with no hot isostatic press treatment of the replacement coupon having been performed.
-
公开(公告)号:US10919119B2
公开(公告)日:2021-02-16
申请号:US16042355
申请日:2018-07-23
Applicant: General Electric Company
Inventor: Dheepa Srinivasan , Joydeep Pal , Debabrata Mukhopadhyay
IPC: B23P6/00 , B33Y10/00 , F01D5/00 , B23K26/342 , B22F3/105 , B22F5/00 , B22F5/04 , C22C1/04 , C22C33/02 , B22F7/06
Abstract: A method for repairing a component is disclosed. The method includes removing a portion originally including a plurality of cooling holes, of the component to form a cavity, forming by additive manufacturing a replacement portion including a plurality of cooling holes, and varying a surface roughness and a diameter of at least one cooling hole of the plurality of cooling holes during the forming by additive manufacturing the replacement portion. The replacement portion replaces the portion of the component.
-
-
-
-