公开(公告)号：US20170147044A1

公开(公告)日：2017-05-25

申请号：US14949075

申请日：2015-11-23

Applicant: General Electric Company

Inventor： David S. Slaton ,  Jerry Leon Wright ,  Brian Patrick Hoden

IPC: G06F1/20

CPC classification number: G06F1/20 ,  H05K1/0209 ,  H05K2201/066

Abstract: Disclosed herein are systems and methods for the thermal regulation of on-board electronic components using a mezzanine filler module. The mezzanine filler module connects at a mezzanine site of the circuit board to provide an additional thermal conduction path for thermal energy released, at least, from component located under the mezzanine site.