摘要:
Two or more transceiver units can interact with each other via millimeter wave radio frequency signals. One of the transceiver units can detect time-varying signals having specific waveforms in order to initiate an action such as establishment of a communication link, powering a piece of equipment and the like. The time-varying signal can be generated by a user moving one of the transceiver units and/or by passing an non-transmissive obstruction in between the transceiver units. Related apparatus, systems, and methods are also disclosed.
摘要:
A low-cost and power-efficient communication system using digital frequency centering techniques suitable for millimeter-wave wide-bandwidth bands with mostly digital components. Significant circuitry in the frequency source can be switched-off, thus conserving power. With the use of non-coherent detection, power consumption can be further reduced as higher phase noise and lower frequency accuracy can be tolerated. In the first embodiment frequency centering is achieved with a multiple-state system which compares a frequency dependent unique state to a programmed or hardwired desired state. In an alternative embodiment this multiple-state system is implemented by means of a microcontroller through either software or hardware.
摘要:
A compact millimeter-wave transmitter and receiver make use of interconnections within a chip-containing package for providing an integrated antenna. Due to shorter wavelength of millimeter-waves, these interconnections can be used as antennas for radiation of electromagnetic waves. A dielectric cover or lens is provided within the package to increase the antenna's directivity and to provide a mechanical shield for the chip.
摘要:
A compact millimeter-wave transmitter and receiver make use of interconnections within a chip-containing package for providing an integrated antenna. Due to shorter wavelength of millimeter-waves, these interconnections can be used as antennas for radiation of electromagnetic waves. A dielectric cover or lens is provided within the package to increase the antenna's directivity and to provide a mechanical shield for the chip.